project managementmanufacturinghardwaresapsemiconductorrefurbishmentbomengineering change order
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Крутая вакансия
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Отличный шанс попасть в мирового гиганта по производству полупроводников. Роль четко определена, хотя работа сосредоточена на восстановлении устаревшего оборудования.
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Текст:
Hirify AI/Оригинал
TL;DR
EPG Refurbish Technical Program Management (Semiconductor Equipment Refurbishment): Managing and coordinating refurbishment projects for EPG 200mm semiconductor equipment with an accent on project planning, cross-functional execution, cost control, and quality objectives. Focus on creating refurbishment statements of work and BOMs, coordinating teardown reviews, tracking schedules and resources, and supporting manufacturing with SAP and engineering change processes.
Location: Tainan, Taiwan. Onsite role with approximately 25% travel, mostly in APAC. Relocation is not available.
Company
hirify.global provides materials science, engineering, manufacturing, refurbishment, and lifecycle support solutions for semiconductor and advanced display equipment.
What you will do
Manage and coordinate refurbishment projects for EPG 200mm and legacy semiconductor equipment from planning through implementation.
Create refurbishment statements of work and delta BOMs, align actual costs with quoted costs, and support cost-reduction initiatives.
Lead core teardown meetings and coordinate reviews with manufacturing and other stakeholders.
Track project schedules, resources, budgets, process improvements, reports, checklists, and progress toward on-time delivery.
Provide technical support to manufacturing, production control, and field teams.
Manage core systems, audits, inventory consumption, and Product Structure Tree database activities.
Requirements
2–4 years of engineering experience in the semiconductor industry, preferably with hardware-related experience.
Technical knowledge of EPG 200mm products and structures and an understanding of the secondary semiconductor equipment market.
Experience with SAP, including multi-level BOM and Where Used queries, as well as Engineering Change Order research.
Proven project management skills and experience with Microsoft Office.
Communication-level English required for global meetings and cross-functional collaboration.
Availability for 25% travel, mostly in APAC.
Nice to have
Experience with semiconductor process tools such as MDP, FEP, or Etch.
Culture & Benefits
Supportive work environment focused on learning, development, and career growth.
Employee health and wellbeing programs and support.
Regular employment with full-time status.
Opportunity to work on equipment supporting semiconductor and advanced display technologies.
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