Director, Advanced Packaging Disruptive Technology (Semiconductor)

Location: Singapore, SGP; Science Park II, moving to Tampines at the end of 2026

Company

Global materials engineering company developing equipment and solutions for semiconductor and advanced display manufacturing.

What you will do

• Define and execute the N+2 and beyond pathfinding roadmap for advanced packaging, including integration, interconnect, materials, and architecture inflections.
• Lead concept incubation and feasibility exploration for disruptive approaches such as D2W, RDL, CoWoS, TSV, heterogeneous integration, chiplets, and advanced substrates.
• Build, lead, and mentor a high-impact exploratory R&D team focused on innovation, prototyping, and technology down-selection.
• Translate customer roadmaps, system architecture trends, and market needs into new product concepts and technology platforms.
• Develop partnerships with materials suppliers, substrate vendors, OSATs, foundries, equipment partners, and research institutions.
• Establish governance for early-stage programs and align engineering, product, and business units on development priorities.

Requirements

• 15+ years of experience in semiconductor technology, advanced packaging, front-end processing, or adjacent domains.
• Leadership experience in technology pathfinding, innovation strategy, or early-stage platform development.
• Strong knowledge of advanced packaging technologies, including D2W, RDL, CoWoS, and TSV.
• Experience building and leading cross-functional or exploratory R&D teams.
• Ability to translate complex technology concepts into business impact and strategic direction.
• Willingness to travel approximately 10–20% for customer engagement, ecosystem collaboration, and industry events.

Nice to have

• Advanced degree in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related field.
• Track record of delivering disruptive or first-of-a-kind technology solutions.
• Experience with heterogeneous integration, chiplet ecosystems, or next-generation packaging architectures.
• Strong network across industry and research communities.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Opportunity to shape long-term innovation in advanced packaging and semiconductor technology.
• Health and wellbeing programs supporting personal and professional development.
• Regular employment position with relocation eligibility.