Director, Advanced Package Assembly and Test Engineering (Taiwan Supplier Development)

Location: Offsite, Taiwan; the role is based at and co-located with the supplier in Taiwan

Company

hirify.global is a semiconductor manufacturer serving high-growth markets with manufacturing operations across the United States, Europe, and Asia.

What you will do

• Build, manage, and develop a Taiwan-based team of 5–6 advanced package assembly and test engineers.
• Lead advanced packaging assembly and test development across package architecture, process integration, NPI, qualification, reliability, yield improvement, and production ramp.
• Act as the senior technical and operational interface with the Taiwan supplier, driving issue resolution, engineering discipline, accountability, and schedule acceleration.
• Establish technical reviews, milestone tracking, risk management, data-driven problem solving, and escalation mechanisms with the supplier.
• Represent hirify.global in customer technical reviews and program discussions, communicating status, risks, and business impact to senior stakeholders.
• Partner with product line, technology development, design, test, quality, reliability, procurement, program management, and business development teams.

Requirements

• 15+ years of experience in semiconductor packaging, assembly engineering, package development, test engineering, supplier engineering, or related advanced manufacturing roles.
• Bachelor’s degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field.
• Proven experience hiring, coaching, developing, and leading technical engineering teams, ideally in Taiwan or the broader Asia semiconductor ecosystem.
• Deep understanding of advanced package assembly and test technologies, including WLCSP, fan-out wafer-level packaging, TSV, flip chip, Cu pillar, micro bump, die attach, substrate-based packages, or heterogeneous integration.
• Strong experience working directly with OSAT suppliers, particularly in Taiwan, as well as NPI, qualification, process development, yield improvement, reliability testing, failure analysis, supplier audits, quality systems, and manufacturing ramp support.
• Excellent English communication skills required; Mandarin Chinese capability is strongly preferred for supplier and customer engagement and local recruiting.

Nice to have

• Leadership experience at or in close partnership with ASE, an OSAT, IDM, fabless semiconductor company, or foundry with advanced packaging programs.
• Experience building a technical team or engineering function from the ground up.
• Experience with package/test co-development, product-to-package integration, test strategy, reliability readiness, and production release.
• Familiarity with optical engines, silicon photonics, co-packaged optics, AI infrastructure, high-speed interconnect, or heterogeneous integration.
• Experience partnering with product management or business development on packaging technology roadmaps and customer commercialization.

Culture & Benefits

• Leadership role within a global semiconductor manufacturing organization.
• Opportunity to establish a local engineering presence and grow a technical team in Taiwan.
• Employment terms and screenings are subject to applicable local laws and regulations.