Director, Advanced Package Assembly and Test Engineering (Taiwan Supplier Development)

Location: Offsite, Taiwan; co-located with the supplier

Company

hirify.global is a semiconductor manufacturer serving high-growth markets through manufacturing operations in the United States, Europe, and Asia.

What you will do

• Build and lead a Taiwan-based team of 5–6 advanced package assembly and test engineers.
• Act as the senior technical and operational interface with the supplier, driving alignment, issue resolution, accountability, and execution.
• Lead advanced packaging assembly and test development across package architecture, process integration, NPI, qualification, reliability, yield improvement, and production ramp.
• Establish technical reviews, milestone tracking, risk management, data-driven problem solving, and escalation mechanisms with the supplier.
• Partner with product, technology, design, test, quality, reliability, procurement, and program management teams.
• Recruit, coach, and retain engineering talent while representing engineering leadership in supplier, customer, and executive forums.

Requirements

• 15+ years of experience in semiconductor packaging, assembly, test, supplier engineering, or related advanced manufacturing roles.
• Bachelor’s degree in materials science, electrical, mechanical, or chemical engineering, physics, or a related technical field.
• Experience leading engineering teams, including hiring and developing technical talent in Taiwan or the broader Asia semiconductor ecosystem.
• Hands-on knowledge of advanced packaging technologies such as WLCSP, fan-out wafer-level packaging, TSV, flip chip, Cu pillar, micro-bump, die attach, substrate-based packages, or heterogeneous integration.
• Strong experience working with OSAT suppliers, particularly in Taiwan, including NPI, qualification, yield improvement, reliability testing, failure analysis, supplier audits, and manufacturing ramp.
• Excellent English communication skills are required; Mandarin Chinese is strongly preferred.

Nice to have

• Leadership experience with ASE, a major OSAT, IDM, fabless semiconductor company, or foundry.
• Experience building a technical team or engineering function from the ground up.
• Background in package/test co-development, product-to-package integration, test strategy, reliability readiness, and production release.
• Familiarity with optical engines, silicon photonics, co-packaged optics, AI infrastructure, high-speed interconnect, or heterogeneous integration.

Culture & Benefits

• Work within a multicultural and inclusive workforce.
• Employment is subject to applicable local laws and successful completion of background checks and medical screenings where applicable.
• Company benefits are provided according to the applicable Asia employment program.