Technical Director, Key Logic Account — Global Field Group (GFG) (Semiconductor Manufacturing)

Location: Hillsboro, OR, United States; on-site. Travel less than 20%, including domestic and international travel to customer sites.

Salary: $176,000–$242,000 per year.

Company

hirify.global develops, builds, and services materials engineering equipment used to manufacture semiconductor chips and advanced displays.

What you will do

• Lead account-wide strategic initiatives to improve device yield, performance, and cost across deposition, etch, anneal, and metrology product areas.
• Partner with customers at development and high-volume manufacturing sites to evaluate emerging technologies and address technical challenges.
• Identify technology inflections and communicate them to product and engineering teams to shape product roadmaps and development priorities.
• Align commercial, technical, and operations groups, driving consensus and outcomes through influence.
• Own timelines, milestones, risk management, and deliverables for strategic initiatives and continuous improvement programs.
• Serve as the senior technical authority for the account, support teams on integration and unit-process issues, mentor engineers, and foster cross-functional collaboration.

Requirements

• B.S. in an engineering discipline, or M.S. in Physics, Chemistry, or an equivalent STEM field.
• At least 12 years of experience in the wafer fabrication or semiconductor capital equipment industry.
• Experience leading complex, cross-functional technical programs and influencing engineering, commercial, and operations outcomes.
• Experience partnering with customers at development and high-volume manufacturing sites, including presenting to and building trust with senior technical and executive stakeholders.
• Recognized, in-depth expertise in semiconductor process engineering, including deposition, etch, anneal, or metrology; or process integration for leading logic or advanced packaging flows.
• Strong understanding of leading logic technologies and process flows.
• Experience integrating value across multiple process technologies to solve device-level yield, performance, or cost problems.
• Ability to explain complex technical concepts and value propositions to technical and business audiences, build executive presentations, lead without direct authority, manage projects, and handle multiple priorities.

Nice to have

• 15+ years of experience in semiconductor capital equipment process engineering, wafer fab process engineering, or wafer fab process integration within a technology development organization.
• Advanced degree such as an M.S. or Ph.D.
• Advanced packaging experience.

Culture & Benefits

• Supportive culture focused on learning, professional development, innovation, and collaboration.
• Comprehensive employee benefits and programs supporting health and wellbeing.
• Potential eligibility for bonus and stock award programs, as applicable.
• Relocation eligible.
• Senior individual-contributor scope with potential to expand into people leadership.