Module Development Engineer (Ph.D.) (Semiconductor Process Development)
Контакты
133 800 - 188 890$
Формат работы
onsite
Тип работы
fulltime
Английский
b2
Страна
US
pythonprocess developmentmetrologylithographyprocess integrationyield analysisetchsemiconductor fabricationthin film deposition
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата и рынок
$134к-189к/год
$120к$160кмедиана$190к
По похожим ролям (50) ~ $160к/год
На СНГ рынке: $1.8к/мес ($1.4к - $2.9к)
88
Отличная вакансия
развернуть
В Company hidden чётко описана практическая разработка полупроводниковых процессов с передачей технологий в массовое производство, а требования и условия достаточно подробно раскрыты.
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Понятные задачиСильный бренд
Оценка от Hirify AI
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Module Development Engineer (Ph.D.) (Semiconductor Process Development): Developing, optimizing, characterizing, and transferring advanced semiconductor processes into high-volume manufacturing with an accent on patterning, material deposition, doping, metrology, yield, and process integration. Focus on designing experiments, applying DOE and process-control systems, resolving equipment and yield excursions, and collaborating with suppliers and integration teams.
Location: Hillsboro, Oregon, United States; onsite at hirify.global Foundry
Annual salary: $133,800–188,890 USD
Company
hirify.global develops and scales advanced semiconductor process technologies for future generations of computing architecture.
What you will do
Develop, optimize, characterize, and transfer advanced semiconductor processes into high-volume manufacturing.
Design, execute, and optimize experimental runs involving process technologies, equipment hardware, and new materials.
Apply statistical modeling, Design of Experiments, SPC, APC, and Run-to-Run control to reduce variability, mitigate defects, and improve yield.
Collaborate with external tool and material suppliers and internal process-integration teams.
Resolve equipment, process, and yield-excursion root causes during technology transfer to high-volume manufacturing.
Document experimental findings, operating procedures, and technical recommendations in engineering reports and presentations.
Requirements
Ph.D. in Electrical Engineering, Chemical Engineering, Materials Science and Engineering, Physics, Mechanical Engineering, Chemistry, or a related STEM field, completed before the start date.
At least 6 months of experience in semiconductor fabrication, process development, device research, materials research, or related semiconductor technology. Experience must include one or more of lithography/overlay, epitaxy, wet etch, dry etch, thin-film deposition, diffusion, ion implantation, CMP/planarization, metals/metallization, dielectrics, metrology, process integration, yield, or electrical characterization.
Nice to have
At least 6 months in a cleanroom or semiconductor research laboratory working directly with fabrication or analytical instrumentation such as ALD, CVD, PVD, plasma etch, CD-SEM, TEM, AFM, or spectroscopic ellipsometry.
At least 6 months using statistical methodologies such as DOE and SPC, plus engineering software or scripting languages such as Python, MATLAB, JMP, C#, or equivalents for data analysis and automation.
Academic or research specialization in transistor architecture, advanced semiconductor materials, or FEOL/BEOL process integration.
Technical findings presented through dissertations, peer-reviewed publications, conference proceedings, patents, or white papers.
Culture & Benefits
Full-time employment based at the Hillsboro, Oregon site.
Health, retirement, and vacation benefits.
Competitive pay and stock bonuses.
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