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12 дней назад

Module Development Engineer (Ph.D.) (Semiconductor Process Development)

133 800 - 188 890$
Формат работы
onsite
Тип работы
fulltime
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Module Development Engineer (Ph.D.) (Semiconductor Process Development): Developing, optimizing, characterizing, and transferring advanced semiconductor processes into high-volume manufacturing with an accent on patterning, material deposition, doping, metrology, yield, and process integration. Focus on designing experiments, applying DOE and process-control systems, resolving equipment and yield excursions, and collaborating with suppliers and integration teams.

Location: Hillsboro, Oregon, United States; onsite at hirify.global Foundry

Annual salary: $133,800–188,890 USD

Company

hirify.global develops and scales advanced semiconductor process technologies for future generations of computing architecture.

What you will do

  • Develop, optimize, characterize, and transfer advanced semiconductor processes into high-volume manufacturing.
  • Design, execute, and optimize experimental runs involving process technologies, equipment hardware, and new materials.
  • Apply statistical modeling, Design of Experiments, SPC, APC, and Run-to-Run control to reduce variability, mitigate defects, and improve yield.
  • Collaborate with external tool and material suppliers and internal process-integration teams.
  • Resolve equipment, process, and yield-excursion root causes during technology transfer to high-volume manufacturing.
  • Document experimental findings, operating procedures, and technical recommendations in engineering reports and presentations.

Requirements

  • Ph.D. in Electrical Engineering, Chemical Engineering, Materials Science and Engineering, Physics, Mechanical Engineering, Chemistry, or a related STEM field, completed before the start date.
  • At least 6 months of experience in semiconductor fabrication, process development, device research, materials research, or related semiconductor technology. Experience must include one or more of lithography/overlay, epitaxy, wet etch, dry etch, thin-film deposition, diffusion, ion implantation, CMP/planarization, metals/metallization, dielectrics, metrology, process integration, yield, or electrical characterization.

Nice to have

  • At least 6 months in a cleanroom or semiconductor research laboratory working directly with fabrication or analytical instrumentation such as ALD, CVD, PVD, plasma etch, CD-SEM, TEM, AFM, or spectroscopic ellipsometry.
  • At least 6 months using statistical methodologies such as DOE and SPC, plus engineering software or scripting languages such as Python, MATLAB, JMP, C#, or equivalents for data analysis and automation.
  • Academic or research specialization in transistor architecture, advanced semiconductor materials, or FEOL/BEOL process integration.
  • Technical findings presented through dissertations, peer-reviewed publications, conference proceedings, patents, or white papers.

Culture & Benefits

  • Full-time employment based at the Hillsboro, Oregon site.
  • Health, retirement, and vacation benefits.
  • Competitive pay and stock bonuses.

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