Member of Technical Staff - Thin Films Engineer (Semiconductor Manufacturing)

Location: Hillsboro, Oregon, United States; hybrid work model with time split between the assigned hirify.global site and off-site work.

Annual salary: $133,800–$255,200 USD.

Company

hirify.global's Manufacturing Development Customer Engineering organization bridges Technology Development and High-Volume Manufacturing to advance semiconductor technology nodes and process capability for hirify.global and foundry customers.

What you will do

• Develop, optimize, and scale thin film deposition processes across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and treatment technologies.
• Drive improvements in safety, quality, yield, throughput, cost, defectivity, and process uniformity.
• Lead technical problem resolution and manufacturing challenge resolution across multiple engineering disciplines.
• Optimize equipment performance with internal teams and suppliers, including AMAT, LAM, ASM, and TEL.
• Collaborate with Technology Development, High-Volume Manufacturing, Business Groups, Integration, Device, Yield, Quality, Reliability, and external suppliers.
• Present technical findings, contribute to technology roadmaps, and support hirify.global 18A, hirify.global 3, 12nm, and next-generation technology nodes.

Requirements

• Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or a related STEM field.
• 5+ years of semiconductor industry experience focused on thin film deposition processes, or a PhD and 3+ years of industry experience.
• Experience in process development, technical leadership, and manufacturing engineering.
• Experience working with equipment suppliers on process optimization.
• Comprehensive fab startup experience across manufacturing, quality, R&D, and supply chain functions.
• Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems.
• Strong analytical, communication, technical problem-solving, project management, and cross-functional leadership capabilities.
• Knowledge of process development, materials science, device physics, semiconductor manufacturing strategies, fab operations, technology transfer, foundry business models, and customer engagement requirements.

Nice to have

• Doctoral degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or a related STEM field, with research publications and a patent portfolio in thin film technologies.
• Expertise in Gate All Around (GAA) logic technologies within semiconductor foundry environments.
• Experience delivering customized solutions across Technology Development and High-Volume Manufacturing organizations.
• Cross-functional leadership experience managing diverse stakeholder groups.
• Semiconductor foundry experience.

Culture & Benefits

• Hybrid work model combining on-site work at the assigned hirify.global site with off-site work.
• Full-time employment with health, retirement, vacation, competitive pay, and stock bonus programs.
• In-person collaboration is expected to accelerate decision-making and problem resolution.
• Shift 1 schedule in the United States.