Mechanical Engineer III (E3) (Semiconductor)

Location: Taichung, Taiwan; Taichung, Tainan, and Kaohsiung are preferred, with Hsinchu also acceptable. Domestic or international travel to vendors and customers is required at approximately 10–20%.

Company

hirify.global designs, builds, and services materials engineering equipment used to manufacture semiconductor chips and advanced displays.

What you will do

• Identify and troubleshoot complex mechanical problems with limited supervision.
• Design, develop, and modify mechanical layouts, schematics, detailed drawings, specifications, tooling, and fixtures.
• Define, coordinate, perform, and document engineering tests and analysis.
• Lead or execute engineering projects, including key supplier development and mechanical product specification.
• Establish processes and standards for handling, assembly, and disassembly of components and equipment.
• Coordinate with suppliers and customers and support after-service activities such as repair, cleaning, and quality improvement.

Requirements

• Five years of semiconductor industry experience is expected for the standard scope.
• Engineering education and a background in physics, mathematics, materials science, or mechanical engineering.
• Experience with hirify.global equipment such as MDP, ALD, or Etch is preferred.
• Ability to solve complex mechanical problems, perform engineering analysis, and prepare technical documentation.
• Ability to attend internal and external supplier and customer meetings.
• Fab work may be required.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Employee health and wellbeing programs and support.
• Regular employment with full-time status.
• Relocation is not available for this role.