Optical Module Hardware Staff Field Application Engineering

Location: Shenzhen, China

Company

hirify.global develops semiconductor solutions that serve as building blocks for enterprise, cloud, AI, and carrier data infrastructure.

What you will do

• Support customers during pre-sales and post-sales design-in, bring-up, validation, and debugging for PAM4 DSP, TIA/Driver, and AEC/ACC solutions.
• Align customer design requirements with hirify.global technology and contribute to proposal development and design-win activities.
• Review signal and power integrity, including topology, vias, return paths, decoupling strategies, and S-parameters.
• Coordinate simulations, correlate models with laboratory results, and recommend hardware design fixes.
• Provide onsite customer support for software-tool issues, hardware and software debugging, and system bring-up.
• Train customers and distributor field application engineers while collaborating with marketing, sales, and quality teams.

Requirements

• Bachelor’s degree with typically 3–10 years of relevant experience, or a master’s degree with typically 1–8 years of relevant experience.
• Hands-on experience with high-speed PAM4 SerDes, optical modules, TIA/Driver front ends, and AEC/ACC hardware through design, bring-up, and testing.
• Fluent written and verbal Chinese and English communication skills.
• Ability to work independently and collaborate effectively with customers and internal teams.
• Applicants must be eligible to access technology and software subject to U.S. export control laws; an export license review may be required.

Nice to have

• Familiarity with C and Python.

Culture & Benefits

• Competitive compensation and benefits.
• Collaborative, transparent, and inclusive work environment.
• Resources and development opportunities to support professional growth.
• Interviews are conducted without unauthorized AI tools, transcription software, or automated note-taking bots.