Назад
Company hidden
5 Π΄Π½Π΅ΠΉ Π½Π°Π·Π°Π΄

Back End (BE) Process Integration Engineer

103Β 730 - 170Β 630$
Π€ΠΎΡ€ΠΌΠ°Ρ‚ Ρ€Π°Π±ΠΎΡ‚Ρ‹
onsite
Π’ΠΈΠΏ Ρ€Π°Π±ΠΎΡ‚Ρ‹
fulltime
Английский
b2
Π‘Ρ‚Ρ€Π°Π½Π°
US
Вакансия ΠΈΠ· списка Hirify.GlobalВакансия ΠΈΠ· Hirify RU Global, списка ΠΊΠΎΠΌΠΏΠ°Π½ΠΈΠΉ с восточно-СвропСйскими корнями
Для мэтча ΠΈ ΠΎΡ‚ΠΊΠ»ΠΈΠΊΠ° Π½ΡƒΠΆΠ΅Π½ Plus

ΠœΡΡ‚Ρ‡ & Π‘ΠΎΠΏΡ€ΠΎΠ²ΠΎΠ΄

Для мэтча с этой вакансиСй Π½ΡƒΠΆΠ΅Π½ Plus

ОписаниС вакансии

ВСкст:
/
TL;DR
Back End (BE) Process Integration Engineer (Semiconductor Manufacturing): Developing and integrating back-end process flows for advanced semiconductor technology nodes with an accent on interconnect integration, RC performance, yield, and reliability. Focus on designing process windows, analyzing statistical data and failure mechanisms, driving corrective actions, and supporting the transition from R&D to high-volume manufacturing.

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $103,730–$170,630 USD

Company

hirify.global develops semiconductor process technologies that support its product roadmap.

What you will do

  • Develop integrated front-end and back-end process flows for new technology nodes.
  • Coordinate process integration across lithography, etch, deposition, diffusion, wet clean, CMP, dielectric, and metrology teams.
  • Optimize resistance-capacitance performance and establish process windows and integration schemes.
  • Analyze yield loss, parametric failures, and root causes using SPC, DOE, FMEA, control charts, and capability analysis.
  • Drive corrective actions, process monitoring, control plans, and improvements to yield and cycle time.
  • Support the transition from R&D to high-volume manufacturing and document process specifications and SOPs.

Requirements

  • PhD in Electrical Engineering, Physics, Applied Physics, Materials Science, Chemical Engineering, Mechanical Engineering, Chemistry, Optics, or a closely related semiconductor field.
  • Hands-on cleanroom experience in interconnect process development, advanced interconnect metallization, electrical characterization of interconnect stacks, or fab-based process development.
  • Experience or knowledge involving RC delay, electromigration, TDDB, via resistance, and low-k dielectric integration.
  • Ability to design experiments, analyze results, and drive process improvements.
  • Strong analytical, presentation, written, and verbal communication skills.
  • Ability to influence cross-disciplinary engineering outcomes and drive projects to completion.

Nice to have

  • Experience with JMP, Python, SQL, MATLAB, JSL, or TCL for real data analysis and automation.
  • Hands-on experience with dry etch, ALD, PECVD, CMP, or metallization in a research or production fab.
  • Familiarity with automation and defect classification systems such as KLA or Applied Materials review tools.

Culture & Benefits

  • Collaborative and supportive environment focused on technology innovation.
  • Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
  • Shift 1 schedule in the United States.
  • Employment practices include equal consideration for qualified applicants.

Π‘ΡƒΠ΄ΡŒΡ‚Π΅ остороТны: Ссли Ρ€Π°Π±ΠΎΡ‚ΠΎΠ΄Π°Ρ‚Π΅Π»ΡŒ просит Π²ΠΎΠΉΡ‚ΠΈ Π² ΠΈΡ… систСму, ΠΈΡΠΏΠΎΠ»ΡŒΠ·ΡƒΡ iCloud/Google, ΠΏΡ€ΠΈΡΠ»Π°Ρ‚ΡŒ ΠΊΠΎΠ΄/ΠΏΠ°Ρ€ΠΎΠ»ΡŒ, Π·Π°ΠΏΡƒΡΡ‚ΠΈΡ‚ΡŒ ΠΊΠΎΠ΄/ПО, Π½Π΅ Π΄Π΅Π»Π°ΠΉΡ‚Π΅ этого - это мошСнники. ΠžΠ±ΡΠ·Π°Ρ‚Π΅Π»ΡŒΠ½ΠΎ ΠΆΠΌΠΈΡ‚Π΅ "ΠŸΠΎΠΆΠ°Π»ΠΎΠ²Π°Ρ‚ΡŒΡΡ" ΠΈΠ»ΠΈ ΠΏΠΈΡˆΠΈΡ‚Π΅ Π² ΠΏΠΎΠ΄Π΄Π΅Ρ€ΠΆΠΊΡƒ. ΠŸΠΎΠ΄Ρ€ΠΎΠ±Π½Π΅Π΅ Π² Π³Π°ΠΉΠ΄Π΅ β†’

ΠŸΠΎΡ…ΠΎΠΆΠΈΠ΅ вакансии

Вакансия ΠΈΠ· списка Hirify.Global
Company hidden
2 дня назад
onsite
united_states
middle

Process and Technology Engineer - (E3) (Semiconductor Manufacturing)

python
materials science
process engineering
failure analysis
root cause analysis
+4 skills
108Β 000 - 148Β 500$
Вакансия ΠΈΠ· списка Hirify.Global
Company hidden
2 дня назад
onsite
united_states
middle

Process Support Engineer (Semiconductor Manufacturing)

statistical analysis
process engineering
root cause analysis
design of experiments
semiconductor manufacturing
+3 skills
86Β 500 - 119Β 000$
Вакансия ΠΈΠ· списка Hirify.Global
Company hidden
12 часов Π½Π°Π·Π°Π΄
united_states

CMP CAT ENG

travel
customer satisfaction
process engineering
process development
semiconductor
+5 skills
108Β 000 - 148Β 500$
Вакансия ΠΈΠ· списка Hirify.Global
Company hidden
2 дня назад
onsite
united_states
lead

Process Support Engineer - Ramp Execution Lead (Semiconductor)

statistical analysis
equipment qualification
root cause analysis
cross functional leadership
design of experiments
+3 skills
108Β 000 - 148Β 500$
Вакансия ΠΈΠ· списка Hirify.Global
Company hidden
1 дСнь назад
united_states
senior/lead

Module Process Engineer IV (E4) - Dielectric Deposition (CVD / ALD) (Semiconductor Manufacturing)

python
process engineering
defect analysis
doe
yield improvement
+5 skills
116Β 000 - 159Β 500$
Вакансия ΠΈΠ· списка Hirify.Global
Company hidden
3 дня назад
united_states
senior

Module Process Engineer V (Semiconductor Packaging)

intellectual property
process development
materials engineering
device physics
design of experiments
+5 skills
140Β 000 - 192Β 500$