5 Π΄Π½Π΅ΠΉ Π½Π°Π·Π°Π΄
Back End (BE) Process Integration Engineer
103Β 730 - 170Β 630$
ΠΡΡΡ & Π‘ΠΎΠΏΡΠΎΠ²ΠΎΠ΄
ΠΠ»Ρ ΠΌΡΡΡΠ° Ρ ΡΡΠΎΠΉ Π²Π°ΠΊΠ°Π½ΡΠΈΠ΅ΠΉ Π½ΡΠΆΠ΅Π½ Plus
ΠΠΏΠΈΡΠ°Π½ΠΈΠ΅ Π²Π°ΠΊΠ°Π½ΡΠΈΠΈ
Π’Π΅ΠΊΡΡ:
TL;DR
Back End (BE) Process Integration Engineer (Semiconductor Manufacturing): Developing and integrating back-end process flows for advanced semiconductor technology nodes with an accent on interconnect integration, RC performance, yield, and reliability. Focus on designing process windows, analyzing statistical data and failure mechanisms, driving corrective actions, and supporting the transition from R&D to high-volume manufacturing.
Location: On-site in Hillsboro, Oregon, United States
Annual salary: $103,730β$170,630 USD
Company
develops semiconductor process technologies that support its product roadmap.
What you will do
- Develop integrated front-end and back-end process flows for new technology nodes.
- Coordinate process integration across lithography, etch, deposition, diffusion, wet clean, CMP, dielectric, and metrology teams.
- Optimize resistance-capacitance performance and establish process windows and integration schemes.
- Analyze yield loss, parametric failures, and root causes using SPC, DOE, FMEA, control charts, and capability analysis.
- Drive corrective actions, process monitoring, control plans, and improvements to yield and cycle time.
- Support the transition from R&D to high-volume manufacturing and document process specifications and SOPs.
Requirements
- PhD in Electrical Engineering, Physics, Applied Physics, Materials Science, Chemical Engineering, Mechanical Engineering, Chemistry, Optics, or a closely related semiconductor field.
- Hands-on cleanroom experience in interconnect process development, advanced interconnect metallization, electrical characterization of interconnect stacks, or fab-based process development.
- Experience or knowledge involving RC delay, electromigration, TDDB, via resistance, and low-k dielectric integration.
- Ability to design experiments, analyze results, and drive process improvements.
- Strong analytical, presentation, written, and verbal communication skills.
- Ability to influence cross-disciplinary engineering outcomes and drive projects to completion.
Nice to have
- Experience with JMP, Python, SQL, MATLAB, JSL, or TCL for real data analysis and automation.
- Hands-on experience with dry etch, ALD, PECVD, CMP, or metallization in a research or production fab.
- Familiarity with automation and defect classification systems such as KLA or Applied Materials review tools.
Culture & Benefits
- Collaborative and supportive environment focused on technology innovation.
- Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
- Shift 1 schedule in the United States.
- Employment practices include equal consideration for qualified applicants.
ΠΡΠ΄ΡΡΠ΅ ΠΎΡΡΠΎΡΠΎΠΆΠ½Ρ: Π΅ΡΠ»ΠΈ ΡΠ°Π±ΠΎΡΠΎΠ΄Π°ΡΠ΅Π»Ρ ΠΏΡΠΎΡΠΈΡ Π²ΠΎΠΉΡΠΈ Π² ΠΈΡ ΡΠΈΡΡΠ΅ΠΌΡ, ΠΈΡΠΏΠΎΠ»ΡΠ·ΡΡ iCloud/Google, ΠΏΡΠΈΡΠ»Π°ΡΡ ΠΊΠΎΠ΄/ΠΏΠ°ΡΠΎΠ»Ρ, Π·Π°ΠΏΡΡΡΠΈΡΡ ΠΊΠΎΠ΄/ΠΠ, Π½Π΅ Π΄Π΅Π»Π°ΠΉΡΠ΅ ΡΡΠΎΠ³ΠΎ - ΡΡΠΎ ΠΌΠΎΡΠ΅Π½Π½ΠΈΠΊΠΈ. ΠΠ±ΡΠ·Π°ΡΠ΅Π»ΡΠ½ΠΎ ΠΆΠΌΠΈΡΠ΅ "ΠΠΎΠΆΠ°Π»ΠΎΠ²Π°ΡΡΡΡ" ΠΈΠ»ΠΈ ΠΏΠΈΡΠΈΡΠ΅ Π² ΠΏΠΎΠ΄Π΄Π΅ΡΠΆΠΊΡ. ΠΠΎΠ΄ΡΠΎΠ±Π½Π΅Π΅ Π² Π³Π°ΠΉΠ΄Π΅ β
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