HSIO Test Solutions Engineering Lead (SerDes)

Location: Irvine, CA, United States

Salary: $138,400–$204,800 per annum, plus eligibility for bonus and equity plans.

Company

hirify.global develops semiconductor solutions that support enterprise, cloud, AI, carrier, networking, and data infrastructure applications.

What you will do

• Develop test strategies and DFT requirements for advanced HSIO, SerDes, chiplet, and die-to-die technologies.
• Influence product testability, observability, and diagnostic capabilities during architecture and design.
• Define and execute test-chip and first-silicon validation strategies, including characterization across voltage, frequency, and temperature conditions.
• Develop production screening methodologies and manufacturing test plans for production deployment.
• Analyze production data and drive improvements in product quality, yield, and test efficiency.
• Lead cross-functional technical reviews, influence decisions, mentor engineers, and collaborate with design, validation, product engineering, reliability, and manufacturing teams.

Requirements

• BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a related field.
• 10+ years of experience in semiconductor Test Engineering, Product Engineering, DFT, Silicon Validation, or related disciplines.
• Strong understanding of semiconductor manufacturing, yield analysis, and qualification methodologies.
• Experience with one or more of: high-speed SerDes, PCIe, CXL, UCIe, die-to-die interfaces, DFT, silicon validation and debug, ATE, production test development, or mixed-signal characterization.
• Demonstrated ability to lead complex cross-functional technical initiatives.
• Applicants must be eligible to access technology and software subject to U.S. export control laws; an export license review may be required.

Nice to have

• MS or PhD in Electrical Engineering, Computer Engineering, or a related field.
• Experience with Advantest 93K or Teradyne UltraFLEX platforms.
• Experience with advanced packaging, chiplets, heterogeneous integration, or AI, networking, cloud, and data center products.
• Experience with Python, automation, analytics, or test infrastructure development.

Culture & Benefits

• Full-time employment with eligibility for bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
• Employee stock purchase plan with a two-year lookback.
• Family support programs and resources for balancing work and home life.
• Mental and physical health resources, including mental health support.
• Recognition and service awards.

Hiring process

• Interviews are designed to evaluate individual experience, thought process, and communication skills in real time.
• AI tools, transcription applications, automated answer generators, and automated note-taking bots are not permitted during interviews.