Sr. Wire Bond Equipment Engineer (Semiconductor)

TL;DR

Sr. Wire Bond Equipment Engineer (Semiconductor): Maintaining and improving wire bond equipment in a semiconductor manufacturing environment with an accent on uptime, reliability, automation, and equipment qualification. Focus on troubleshooting complex equipment issues, analyzing performance data, improving yield, and leading sustaining and upgrade projects.

Location: Onsite in Kaohsiung, Taiwan

Company

hirify.global develops semiconductor technologies and operates manufacturing and engineering activities worldwide.

What you will do

• Maintain and support wire bond equipment to ensure high uptime and reliability.
• Troubleshoot equipment failures, perform root cause analysis, and implement corrective actions.
• Execute preventive maintenance and continuous equipment improvement initiatives.
• Lead equipment qualification, sustaining, upgrade, and automation projects.
• Analyze equipment performance data to improve productivity, yield, and product quality.
• Develop technical documentation and train technicians on equipment operation and troubleshooting.

Requirements

• Bachelor’s degree or higher in an engineering-related field; mechanical or electrical engineering is preferred.
• At least 3 years of semiconductor manufacturing experience.
• Strong troubleshooting and root cause analysis skills.
• Familiarity with SPC, FMEA, 8D, and continuous improvement methodologies.
• Good communication and teamwork skills, with the ability to support a fast-paced manufacturing environment.
• TOEIC score above 600 or another comprehensive English certification is required.

Nice to have

• Experience with wire bonders such as K&S Rapid or ASM AERO.
• Knowledge of automation, SECS/GEM, and equipment data analysis.
• Six Sigma Green Belt or an equivalent certification.

Culture & Benefits

• Cross-functional collaboration with Process, Production, and Quality teams.
• Hands-on work in a fast-paced semiconductor manufacturing environment.
• Opportunities to improve manufacturing productivity, equipment reliability, and product quality.