Thermal Design Engineer (HPC)

TL;DR

Thermal Design Engineer (HPC): Supporting the design, simulation, and physical testing of thermal management solutions for next-generation fabric platforms with an accent on heat transfer and fluid dynamics. Focus on executing CFD simulations, conducting lab validation with DAQ systems, and optimizing electronics cooling for high-performance computing environments.

Location: Hybrid (Wayne, PA); candidate must reside within commuting distance

Company

hirify.global delivers innovative purpose-built interconnect solutions that enable customers to optimally apply vast computational resources to solve complex scientific and commercial problems.

What you will do

• Execute thermal measurements and qualification testing using thermocouples and data acquisition (DAQ) systems.
• Perform CFD and thermal simulations, including modeling, pre-/post-processing, and detailed analysis.
• Support the thermal design and evaluation of PCBs, heat sinks, and thermal interface materials (TIMs).
• Analyze thermal test data and contribute to formal engineering reports and guidelines.
• Collaborate with mechanical, electrical, and manufacturing teams to ensure product readiness and design constraints.

Requirements

• BS in Mechanical Engineering with a focus on Thermodynamics, Heat Transfer, or Fluid Dynamics.
• 0-3 years of experience in thermal engineering (internships, co-op, or academic lab experience included).
• Hands-on experience in lab environments with thermal sensors and test execution.
• Familiarity with 3D MCAD tools, specifically CREO or SolidWorks.
• Basic knowledge of CFD tools and concepts (e.g., Cadence Celsius EC, Siemens Flotherm, or Ansys Icepak).

Nice to have

• MS in Mechanical Engineering.
• Scripting experience in Python or MATLAB for test automation and data analysis.
• Prior experience with Cadence Celsius EC for electronics cooling simulation.
• Familiarity with liquid cooling systems, cold plates, or two-phase cooling methods.
• Exposure to high-performance computing (HPC) or data center environments.

Culture & Benefits

• Opportunity to work on cutting-edge high-performance interconnect technologies.
• Collaborative, cross-disciplinary engineering environment.
• Hybrid work model combining on-site presence and remote flexibility.