Module Development Engineering Manager (Semiconductor)

TL;DR

Module Development Engineering Manager (Semiconductor Manufacturing): Leading a team of engineers to develop and implement innovative solutions for wafer processing and assembly/test factories with an accent on technology transfer and cost optimization. Focus on defining technology roadmaps, managing cross-functional collaboration, and ensuring power performance leadership.

Location: On-site in Hillsboro, Oregon, USA

Salary: $133,800 - $219,550 USD

Company

Global leader in semiconductor manufacturing and processor design.

What you will do

• Lead a team of module development engineers to implement advanced technology solutions.
• Define and oversee technology roadmaps aligned with strategic goals.
• Partner with integration, device, and yield engineering teams to develop robust process solutions.
• Manage resources and priorities to meet project schedules and maximize operational outcomes.
• Collaborate with supplier executive management to drive research innovations.
• Mentor engineering teams in pathfinding and technology road mapping for advanced development.

Requirements

• Bachelor’s degree in engineering, Materials Science, Physics, or related fields (6+ years experience), Master’s (4+ years), or PhD (2+ years).
• Must be based in or be able to work on-site in Hillsboro, Oregon, USA.
• Expertise in optical characterization, scripting, statistics, and data analytics.
• Proven experience managing engineering teams and driving results in complex environments.

Nice to have

• Experience in Metrology and defect inspections equipment.
• Knowledge of semiconductor fabrication and packaging technologies.
• Familiarity with wafer equipment, processes, or singulation techniques.
• Prior experience in a technical leadership role or metrology tool ownership.

Culture & Benefits

• Competitive pay and stock bonuses.
• Comprehensive health, retirement, and vacation programs.
• Industry-leading total compensation package.