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Module Development Engineering Manager (Semiconductor)

133 800 - 219 550$
Формат работы
onsite
Тип работы
fulltime
Грейд
lead
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Module Development Engineering Manager (Semiconductor): Leading module development engineers in creating, transferring, and implementing advanced technology solutions for wafer processing, assembly/test, and module repair factories with an accent on optical characterization, metrology, process development, and technology roadmaps. Focus on developing robust process solutions, managing cross-functional engineering programs, and building long-term capabilities for advanced semiconductor manufacturing.

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $133,800–$219,550 USD

Company

hirify.global develops and manufactures semiconductor technologies, including wafer processing, assembly/test, and advanced module solutions.

What you will do

  • Lead a team of module development engineers developing, implementing, and transferring advanced technology solutions.
  • Define and manage module technology roadmaps aligned with strategic objectives.
  • Manage resources, priorities, project schedules, and operational outcomes across organizational boundaries.
  • Partner with integration, device, and yield engineering teams to develop process solutions focused on power performance and structural efficiency.
  • Build supplier partnerships and support research innovation, pathfinding, and long-term module engineering strategies.
  • Set goals and performance benchmarks, coach engineers, and foster an inclusive, productive work environment.

Requirements

  • Bachelor’s degree in engineering, Materials Science, Physics, or a related field and 6+ years of experience; or a master’s degree and 4+ years; or a PhD and 2+ years.
  • Expertise in optical characterization, scripting, statistics, data analytics, and problem solving.
  • Experience managing engineering teams and driving results in complex environments.
  • Ability to lead cross-functional collaboration and translate conflicting technical data into actionable solutions.
  • Ability to work on-site in Hillsboro, Oregon, United States.

Nice to have

  • Experience with metrology and defect inspection equipment, semiconductor fabrication, packaging technologies, or advanced module engineering.
  • Familiarity with wafer equipment, processes, or singulation techniques.
  • Experience in a technical leadership role or with metrology tool ownership.

Culture & Benefits

  • Competitive pay, stock bonuses, health benefits, retirement programs, and vacation.
  • Focus on collaboration, accountability, inclusion, and professional development.
  • Shift 1 schedule in the United States.

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