обновлено 5 дней назад
Module Development Engineering Manager (Semiconductor)
133 800 - 219 550$
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
Module Development Engineering Manager (Semiconductor): Leading module development engineers in creating, transferring, and implementing advanced technology solutions for wafer processing, assembly/test, and module repair factories with an accent on optical characterization, metrology, process development, and technology roadmaps. Focus on developing robust process solutions, managing cross-functional engineering programs, and building long-term capabilities for advanced semiconductor manufacturing.
Location: On-site in Hillsboro, Oregon, United States
Annual salary: $133,800–$219,550 USD
Company
develops and manufactures semiconductor technologies, including wafer processing, assembly/test, and advanced module solutions.
What you will do
- Lead a team of module development engineers developing, implementing, and transferring advanced technology solutions.
- Define and manage module technology roadmaps aligned with strategic objectives.
- Manage resources, priorities, project schedules, and operational outcomes across organizational boundaries.
- Partner with integration, device, and yield engineering teams to develop process solutions focused on power performance and structural efficiency.
- Build supplier partnerships and support research innovation, pathfinding, and long-term module engineering strategies.
- Set goals and performance benchmarks, coach engineers, and foster an inclusive, productive work environment.
Requirements
- Bachelor’s degree in engineering, Materials Science, Physics, or a related field and 6+ years of experience; or a master’s degree and 4+ years; or a PhD and 2+ years.
- Expertise in optical characterization, scripting, statistics, data analytics, and problem solving.
- Experience managing engineering teams and driving results in complex environments.
- Ability to lead cross-functional collaboration and translate conflicting technical data into actionable solutions.
- Ability to work on-site in Hillsboro, Oregon, United States.
Nice to have
- Experience with metrology and defect inspection equipment, semiconductor fabrication, packaging technologies, or advanced module engineering.
- Familiarity with wafer equipment, processes, or singulation techniques.
- Experience in a technical leadership role or with metrology tool ownership.
Culture & Benefits
- Competitive pay, stock bonuses, health benefits, retirement programs, and vacation.
- Focus on collaboration, accountability, inclusion, and professional development.
- Shift 1 schedule in the United States.
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