Principal SoC Chip Lead

Location: Shanghai (Pudong), China

Company

hirify.global develops semiconductor products, including solutions for automotive and industrial applications.

What you will do

• Own SoC program execution from project definition through tape-out and post-silicon support.
• Drive technical decisions across architecture, integration, verification, implementation, validation, and system engineering.
• Lead Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams.
• Develop execution plans with PMO and SoC project management, monitoring schedules, resources, critical paths, and risks.
• Coordinate tape-out readiness, signoff closure, silicon bring-up, validation, debugging, and issue resolution.
• Communicate technical readiness, project status, risks, and mitigation plans to internal and external stakeholders.

Requirements

• Bachelor’s degree or higher in Microelectronics, Electrical Engineering, or a related discipline.
• 6+ years of semiconductor industry experience.
• Proven SoC development experience from architecture through tape-out.
• Strong understanding of architecture, RTL design, integration, verification, DFT, emulation, physical design, and silicon validation.
• Experience leading large cross-functional engineering teams in a matrix organization.
• Strong project planning, execution, risk management, communication, leadership, and stakeholder management skills.

Nice to have

• Previous experience as a Chip Lead, SoC Technical Lead, Chief Engineer, or Project Technical Leader.
• Experience with automotive, industrial, or safety-critical semiconductor products.
• Experience working with global development teams across multiple sites.
• Successful delivery of multiple SoC tape-outs and post-silicon product ramps.

Culture & Benefits

• Full-time employment.
• Cross-functional collaboration across architecture, design, verification, implementation, validation, product, and business teams.
• Work involving strategic technical decision-making, problem solving, risk management, and stakeholder influence.