Lithography Module Engineer (Semiconductor)

TL;DR

Lithography Module Engineer (Semiconductor): Managing and optimizing 300mm lithography toolsets for high-volume manufacturing with an accent on process stability, yield improvement, and tool matching. Focus on driving continuous improvement roadmaps, troubleshooting complex manufacturing excursions, and supporting new technology startups.

Location: On-site in Phoenix, Arizona

Salary: $89,010–$170,630 USD

Company

hirify.global is a global leader in computing technology, dedicated to creating next-generation technologies that shape the future of high-volume manufacturing.

What you will do

• Own all aspects of 300mm lithography toolsets, ensuring safety, cleanliness, and 100% matching.
• Drive continuous improvement roadmaps to achieve record tool availability and low defect densities.
• Plan and conduct experiments to characterize processes throughout the development cycle.
• Develop and establish equipment configurations, procedures, and process control systems.
• Troubleshoot manufacturing issues using statistical analysis and data-driven problem-solving.
• Transfer processes to high-volume manufacturing and support new factory startups.

Requirements

• Bachelor's degree in STEM with 4+ years of experience, Master's with 2+ years, or PhD.
• Proven experience in semiconductor process engineering or high-volume manufacturing.
• Strong background in lithography, patterning, process control, or yield improvement.
• Experience troubleshooting manufacturing issues using statistical analysis.
• Ability to work on-site in Phoenix, Arizona.

Nice to have

• Direct experience with EUV or immersion lithography.
• Proficiency with JMP or Python for data analysis.
• Experience with DOE, SPC, and tool qualification.
• Foundry or OSAT industry experience.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Opportunity to work in a high-performing team culture with a focus on accountability and innovation.
• Access to cutting-edge semiconductor manufacturing technology and development.