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3 дня назад

Principal Signal/Power Integrity Engineer (Semiconductors)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Israel
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR

Principal Signal/Power Integrity Engineer (Semiconductors): Developing creative power and signal integrity solutions for high-speed device interfaces at package and system levels with an accent on PDN optimization and electromagnetic simulation. Focus on ensuring electrical performance for high-speed interfaces like DDR4, PCIe, and Ethernet while collaborating with layout and IP teams.

Location: Yokneam, Israel

Company

hirify.global is a semiconductor company providing essential building blocks for data infrastructure across cloud, AI, and carrier architectures.

What you will do

  • Develop creative power solutions for semiconductor devices at both package and system levels.
  • Evaluate designs to ensure they meet challenging electrical performance requirements.
  • Collaborate with layout engineers and IP teams to optimize power delivery network (PDN) performance.
  • Perform simulations, evaluate new EDA tools, and develop scripts for efficiency improvements.
  • Create and validate signal integrity solutions for high-speed device interfaces using electromagnetic simulation tools.

Requirements

  • BSc in Electrical Engineering.
  • 10-15 years of related experience in power and signal integrity.
  • Expertise in PDN design, modeling, and analysis using tools such as PowerSI and SIwave.
  • Deep knowledge of high-speed signal integrity for interfaces such as DDR4, PCIe Gen3/4, and Ethernet (10G to 200Gbps).
  • Proven ability to collaborate effectively with engineers across multiple geographies.
  • Must be eligible to access export-controlled information under U.S. export control laws (EAR).

Nice to have

  • Experience with 3D electro-magnetic extraction tools, such as Ansys HFSS.
  • Knowledge of power supply designs and hands-on measurement experience.
  • Experience with 2.5D/3D package development.
  • Familiarity with packaging technologies, materials, substrate design rules, and assembly processes.

Culture & Benefits

  • Competitive compensation and comprehensive benefits package.
  • Work environment characterized by shared collaboration, transparency, and inclusivity.
  • Strong dedication to professional growth and providing resources for career development.
  • Commitment to fair and authentic hiring practices (strict policy against AI tool usage during interviews).

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