Senior Staff Manager for Procurement (Advanced Semiconductor Packaging)

Location: Santa Clara, California, United States

Salary: $140,620–$210,000 per annum

Company

hirify.global develops semiconductor solutions that provide essential building blocks for enterprise, cloud, AI, networking, optical interconnect, custom silicon, and accelerated infrastructure.

What you will do

• Develop and execute sourcing strategies for advanced packaging services, assembly and test operations, semiconductor test equipment, engineering development systems, and production test infrastructure.
• Lead supplier selection, commercial negotiations, contract management, and strategic supplier relationship management.
• Support sourcing for 2.5D and 3D packaging, chiplet architectures, HBM-integrated designs, silicon interposers, advanced substrates, and heterogeneous integration platforms.
• Establish procurement strategies for ATE, burn-in, system-level test, probe and handler equipment, test interface hardware, and production qualification platforms.
• Partner with engineering, operations, manufacturing, finance, quality, supply planning, and executive leadership on NPI, manufacturing readiness, technology roadmaps, and product scalability.
• Drive cost optimization, supplier performance improvements, supply assurance, alternate sourcing, and business continuity planning.

Requirements

• Bachelor's degree in engineering, supply chain, business, operations management, or a related discipline.
• 8+ years of procurement, supply chain, sourcing, operations, or supplier management experience in the semiconductor industry.
• Experience negotiating complex commercial agreements and managing strategic supplier relationships.
• Strong understanding of semiconductor manufacturing and product development flows.
• Demonstrated analytical, financial, problem-solving, communication, and stakeholder management skills.
• Applicants must be eligible to access export-controlled technology and software under U.S. export control laws; an export license review may be required before employment.

Nice to have

• MBA or master's degree in engineering, supply chain, or business.
• Direct sourcing experience with advanced packaging, OSAT services, semiconductor test equipment, capital equipment, or manufacturing services.
• Experience supporting AI accelerators, networking ASICs, custom silicon, cloud infrastructure, or high-performance computing products.
• Knowledge of CoWoS, chiplet integration, HBM packaging, silicon interposers, OSAT models, product qualification, yield improvement, wafer sort, final test, burn-in, and high-volume manufacturing.
• Experience managing annual spend programs exceeding $50 million.

Culture & Benefits

• Cross-functional work with engineering, operations, finance, manufacturing, quality, and executive leadership.
• Employee stock purchase plan with a two-year lookback.
• Family support programs and mental and physical health resources.
• Recognition and service awards.
• Benefits supporting financial well-being, family support, health, and retirement.

Hiring process

• Interview process details are shared during hiring.
• AI tools, transcription apps, real-time answer generators, and automated note-taking bots are prohibited during interviews.