Senior CPU Physical Design Engineer (AI)

TL;DR

Senior CPU Physical Design Engineer (Semiconductors): Driving physical implementation and optimization of high-performance CPU designs with an accent on RTL-to-GDS workflows, timing analysis, and power efficiency. Focus on building advanced processor technologies for data center and AI-driven products while collaborating with cross-functional teams to solve complex microarchitecture challenges.

Location: Must be based in Austin, Texas (On-site)

Salary: $164,470–$269,100 USD

Company

hirify.global is a global leader in semiconductor technology, developing innovative processor solutions that power billions of devices worldwide.

What you will do

• Perform physical design implementation for custom CPUs, transforming RTL into manufacturing-ready databases.
• Execute full physical design flows including floor planning, synthesis, place and route, and clock tree synthesis.
• Conduct comprehensive verification and signoff processes such as static timing analysis and layout verification.
• Collaborate with architecture, logic, and circuit teams to optimize microarchitectures for power, area, and frequency.
• Develop and refine physical design methodologies and flow automation to enhance efficiency.
• Work with EDA vendors to improve tool capabilities for high-speed, low-power CPU synthesis.

Requirements

• Must be authorized to work in the US (no immigration sponsorship provided).
• Bachelor's degree with 6+ years, Master's with 4+ years, or PhD with 2+ years of relevant experience.
• Proficiency in physical design EDA tools like Synopsys Fusion Compiler or Cadence Innovus.
• Experience with scripting languages such as TCL, Perl, or Python for automation.
• Proven track record of completing at least one tape-out on advanced process nodes.
• Experience with RTL-to-GDS automation and AI/ML-based place-and-route methods.

Nice to have

• Expertise in low-power design techniques and multiple power domains (UPF).
• Deep understanding of CMOS process technology and digital design fundamentals.
• Experience with thermal and power reduction techniques in APR.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Opportunity to work on industry-leading technologies and next-generation CPU products.
• Collaborative environment with global engineering teams.