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3 дня назад

Module Development Engineer (Semiconductor)

133 800 - 188 890$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

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TL;DR

Module Development Engineer (Semiconductor): Designing and optimizing advanced manufacturing processes for semiconductor fabrication with an accent on material selection, plasma physics, and equipment metrology. Focus on pioneering materials, improving production efficiency, and transitioning academic research into high-volume manufacturing solutions.

Location: On-site in Hillsboro, Oregon, US

Salary: $133,800 – $188,890 USD

Company

A global leader in semiconductor manufacturing and innovation.

What you will do

  • Develop and optimize advanced manufacturing processes, including material selection and system design.
  • Conduct feasibility studies to support innovative device architectures and manufacturing roadmaps.
  • Implement modifications to operating equipment to enhance production efficiency and output.
  • Collaborate with equipment and material suppliers to integrate enabling technology solutions.
  • Perform theoretical simulations and practical engineering to test process feasibility.
  • Drive the development of cost-sensitive technology roadmaps with internal and external stakeholders.

Requirements

  • PhD in a STEM discipline (Electrical Engineering, Materials Science, Physics, Chemical Engineering, or Chemistry).
  • Fundamental knowledge of plasma physics, surface reactions, and thin film processes.
  • Experience with experimental design, data collection, and statistical analysis.
  • Ability to work in a fab or lab environment following strict safety and contamination protocols.
  • Strong technical communication skills for reports and presentations.

Nice to have

  • Research focus on plasma etch, pattern transfer, or advanced logic/memory process integration.
  • Hands-on experience with dry etch tools (e.g., Lam, Applied Materials, TEL, ASM, Hitachi).
  • Knowledge of high aspect ratio etching, CD control, and etch selectivity.
  • Programming skills in Python, MATLAB, or JMP for data analysis and automation.
  • Experience with semiconductor characterization techniques (e.g., SEM, TEM, AFM, XPS).

Culture & Benefits

  • Competitive total compensation package including stock bonuses.
  • Comprehensive health, retirement, and vacation programs.
  • Opportunity to work at the forefront of semiconductor innovation.
  • Collaborative environment with world-class teams and industry leaders.

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