Senior Engineer Mid End (Trim & Form)

Location: Seremban, Malaysia; onsite

Company

hirify.global is a semiconductor manufacturer focused on high-volume production and advanced packaging technologies.

What you will do

• Lead maintenance, optimization, reliability, and continuous improvement of trim and form equipment across semiconductor package types.
• Analyze equipment downtime using MTBF and MTBA, develop mitigation strategies, and verify scheduled downtime activities.
• Partner with Process Engineering, R&D, NPI, Product Design, and Reliability teams on new product qualification, equipment readiness, and technology transfers.
• Diagnose equipment, tooling, and process defects affecting yield and product quality, while driving MVA, yield enhancement, and UPH optimization.
• Manage technician coverage for 24/7 operations, delegate work, and mentor technicians through KPI setting and performance evaluations.
• Manage spare parts, procurement, supplier coordination, tooling, jigs, fixtures, and cost optimization.

Requirements

• Bachelor’s degree in engineering or a related technical discipline.
• Minimum 5 years of semiconductor industry experience, including at least 3 years specializing in trim and form equipment and tooling.
• Hands-on experience with trim and form machines used in semiconductor packaging.
• Knowledge of tooling design, material properties, GD&T, tolerances, and metrology equipment.
• Proficiency with JMP and Minitab, statistical analysis, and technical documentation.
• Leadership, analytical, problem-solving, and cross-functional communication skills in a 24/7 manufacturing environment.

Culture & Benefits

• Fast-paced, dynamic semiconductor manufacturing environment.
• Inclusive recruitment process and equal-opportunity employment.
• Safe work environment with reasonable adjustments available where requested.
• Access to employee resource groups, including the Pride Network Group and global and local women’s groups.