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2 часа назад

Senior Equipment Engineer (Trim & Form)

Тип работы
fulltime
Грейд
senior/lead
Английский
b2
Страна
Malaysia
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR

Senior Equipment Engineer (Trim & Form) (Semiconductor Manufacturing): Lead maintenance, optimization, and continuous improvement of trim and form equipment for high-volume semiconductor packaging with an accent on equipment reliability, downtime mitigation (MTBF/MTBA), and yield/UPH optimization. Focus on cross-functional readiness for new product introductions, defect diagnosis across equipment/tooling/process, and ramp-up to HVM while mentoring technicians for 24/7 operations.

Company

Semiconductor manufacturer focused on reliable, high-volume production and advanced packaging technologies.

What you will do

  • Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
  • Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; verify and manage scheduled downtime effectiveness.
  • Partner with Process Engineering for new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
  • Collaborate on technical documentation (control plans, process specifications, SOPs, FMEAs, and technical reports) and support technology/process/equipment transfers.
  • Diagnose and resolve trim and form equipment, tooling, and process defects impacting yield and product quality; support ramp-up to HVM.
  • Plan technician coverage for 24/7 operations, delegate tasks, and mentor technicians (KPI setting and annual performance evaluations).

Requirements

  • Bachelor’s degree in engineering or a related technical discipline.
  • Minimum 5 years of semiconductor industry experience, including at least 3 years specializing in trim and form equipment and tooling.
  • Strong hands-on experience with trim and form machines used in semiconductor packaging.
  • Solid knowledge of tooling design, material properties and behavior, GD&T, tolerances, and metrology equipment (added advantage).
  • Proficiency in statistical analysis tools such as JMP and Minitab, plus strong technical documentation skills.
  • Proven leadership capability guiding technicians in a 24/7 manufacturing environment.

Culture & Benefits

  • Inclusive, equal-opportunity recruitment with reasonable adjustments available.
  • Support for employee resource groups (e.g., Pride Network Group and women’s groups).
  • Commitment to increasing women in management positions to 30% by 2030.

Hiring process

  • Structured, inclusive recruitment process with candidate accessibility and fair consideration.

Location: Seremban

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