Process Engineer (Semiconductor)

Location: Bayan Lepas, Malaysia; onsite, remote work not available

Company

hirify.global is an embedded semiconductor solution provider developing technology for automotive, industrial, infrastructure, and IoT applications.

What you will do

• Develop, optimize, and sustain die bonding and wire bonding processes.
• Troubleshoot yield losses, defects, and equipment issues through root cause analysis.
• Support new product introduction, process qualification, and transfer to mass production.
• Establish process parameters, work instructions, and control plans.
• Analyze process data using SPC, CPK, trend analysis, and other statistical methods.
• Collaborate with Production, Quality, Equipment, and R&D teams to improve cost, yield, cycle time, and reliability.

Requirements

• Bachelor’s degree in Materials Engineering, Mechanical Engineering, or a related field.
• Minimum 2 years of hands-on experience in semiconductor back-end assembly.
• Strong knowledge of die bonding and wire bonding processes.
• Familiarity with leadframes, substrates, adhesives, and bonding wires.
• Problem-solving, communication, and teamwork skills.

Nice to have

• Experience with QFN or similar packages.
• Experience with process characterization, DOE, yield improvement, reliability testing, and failure analysis.
• Exposure to automation, equipment setup, and process optimization.

Culture & Benefits

• Regular, full-time employment.
• Competitive benefits package alongside salary.
• Global environment with engineers and problem solvers across more than 30 countries.
• Culture grounded in transparency, agility, global collaboration, innovation, and entrepreneurship.