Packaging Module Development Engineer (Semiconductor)

TL;DR

Packaging Module Development Engineer (Semiconductor): Developing assembly processes and equipment for future packaging platform technologies with an accent on quality, reliability, and manufacturability. Focus on applying statistical process control, design of experiments, and AI/ML concepts to optimize manufacturing efficiency and solve complex failure mechanisms.

Location: Must be based in Phoenix, Arizona (On-site)

Salary: $133,800–$219,550 USD

Company

hirify.global is a global leader in semiconductor manufacturing, driving innovation in silicon process and advanced packaging technology for the AI era.

What you will do

• Develop and optimize assembly processes and equipment to meet quality, reliability, and cost requirements.
• Apply design of experiments and statistical methods to improve manufacturing efficiency and yield.
• Establish material specifications and collaborate with vendors to ensure high-quality performance.
• Develop new acceleration methods and tools for early identification of packaging reliability issues.
• Lead innovation and problem-solving efforts to mature packaging technologies for future products.
• Document process improvements and provide technical consultation on packaging challenges.

Requirements

• Master's degree in Mechanical, Materials, Electrical Engineering, Physics, or related STEM field with 3+ years of industry experience OR PhD with 1+ years of experience.
• Minimum cumulative GPA of 3.5.
• Must be able to work on-site in Phoenix, Arizona.
• Experience with technology development, including Statistical Process Control (SPC) and Design of Experiments (DOE).
• Strong experimental background with hands-on laboratory or prototype development experience.
• Proficiency in programming or scripting (Python, MATLAB) with exposure to AI and machine learning concepts.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive health and retirement benefit programs.
• Paid vacation and time-off policies.
• Opportunity to work at the forefront of semiconductor and AI hardware manufacturing.