Substrate Packaging Research And Development Engineer (Semiconductors)

TL;DR

Substrate Packaging Research And Development Engineer (Semiconductors): Developing innovative assembly processes and equipment solutions to enable future packaging technology roadmaps with an accent on process development, equipment optimization, and package reliability. Focus on leveraging experimental design and statistical analysis to qualify new packaging solutions and ensure manufacturability.

Location: Hybrid; must be based in Phoenix, Arizona, US

Salary: $133,800 - $188,890 USD

Company

Global leader in semiconductor manufacturing and processor technology, inventing at the boundaries of technology to solve global challenges.

What you will do

• Develop innovative assembly processes and equipment solutions for future packaging platforms.
• Optimize manufacturing efficiency to meet quality, reliability, cost, and yield requirements.
• Create process and equipment specifications using Design of Experiments (DoE) and data analysis.
• Evaluate silicon and package technologies under simulated field conditions including heat, humidity, and dynamic forces.
• Oversee the physical layout manufacturability and the full cycle of package processes and flows.
• Collaborate with contract assemblers and vendors to establish material specifications and ensure quality.

Requirements

• PhD degree in Materials Science, Mechanical, Electrical, Chemical Engineering, Organic Chemistry, Polymer Engineering, or similar.
• 2+ years of experience combining engineering judgment and data analysis to build models and design experiments.
• Strong background in materials science, engineering, and material characterization techniques.
• Proficiency in Design of Experiments (DoE), statistical data analysis, and statistical process control (SPC).
• Must be based in Phoenix, Arizona, US for regular onsite presence.

Nice to have

• Working knowledge or prior experience in optics and lasers.
• Experience in laser micro-machining and micro-fabrication.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive benefit programs covering health, retirement, and vacation.
• Hybrid work model allowing a split between on-site and off-site work.