TD Media and Collaterals Development Engineer (Engineering)

TL;DR

TD Media and Collaterals Development Engineer (Semiconductor Manufacturing): Developing media and collaterals for assembly processes and equipment to enable future packaging platform technologies with an accent on manufacturing efficiency, quality, and reliability. Focus on applying design of experiments (DOE), creating novel materials solutions, and simulating field use conditions like heat and vibration.

Location: On-site presence required in Phoenix, Arizona, US

Salary: $115,110 - $162,500 USD

Company

hirify.global is a global leader in semiconductor manufacturing and foundry services, focusing on state-of-the-art silicon process and packaging technology for the AI era.

What you will do

• Develop media and collaterals for assembly processes and equipment to support future packaging platforms.
• Optimize manufacturing efficiency to meet quality, reliability, cost, and productivity requirements.
• Create specifications using Design of Experiments (DOE) and document improvements through white papers.
• Maintain and utilize equipment to evaluate solutions under simulated field conditions such as heat, humidity, and vibration.
• Develop new techniques and quality screens for early identification of reliability and quality problems.
• Collaborate with packaging technology development and partner engineering groups to ensure product milestones are met.

Requirements

• BS/MS/PhD degree in Mechanical Engineering, Material Engineering, Electrical Engineering, or Physics.
• Minimum 6 months of experience in applying science and engineering concepts to create novel solutions.
• Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
• Must be based in or able to work on-site in Phoenix, Arizona.

Nice to have

• Proficiency in mechanical design software such as SolidWorks or AutoCAD.
• Portfolio of self-completed projects from concept to fabrication.
• Experience with assembly equipment, processes, media, or collaterals.
• Understanding of semiconductor fabrication processes and technology.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive benefit programs including health, retirement, and vacation.
• Opportunity to work within a worldwide factory network on cutting-edge semiconductor technology.