Process Engineer (Semiconductor)

Location: Bayan Lepas, Malaysia; onsite only

Company

hirify.global is an embedded semiconductor solution provider developing technology for automotive, industrial, infrastructure, and IoT applications.

What you will do

• Develop, optimize, and sustain die bonding and wire bonding processes.
• Troubleshoot yield losses, defects, and equipment issues through root cause analysis.
• Support new product introduction, process qualification, and transfer to mass production.
• Establish process parameters, work instructions, and control plans.
• Analyze process data using SPC, CPK, trend analysis, and other statistical methods.
• Drive improvements in cost, yield, cycle time, and reliability with Production, Quality, Equipment, and R&D teams.

Requirements

• Bachelor’s degree in Materials Engineering, Mechanical Engineering, or a related field.
• At least 2 years of hands-on experience in semiconductor back-end assembly.
• Strong knowledge of die bonding and wire bonding processes.
• Familiarity with leadframes, substrates, adhesives, and bonding wires.
• Good problem-solving, communication, and teamwork skills.

Nice to have

• Experience with QFN or similar semiconductor packages.
• Knowledge of yield improvement, reliability testing, and failure analysis.
• Experience with process characterization, DOE, automation, equipment setup, or process optimization.

Culture & Benefits

• Regular permanent employment with a full-time schedule.
• Collaboration across Production, Quality, Equipment, and R&D functions.
• Competitive benefits package provided alongside the salary.
• Work within a global organization of more than 21,000 engineers and problem solvers.