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updated 16 days ago

Chiplet Design Architect

100 000 - 500 000$
Work format
remote (only USA)
Work type
fulltime
Grade
senior
English
b2
Country
US
This vacancy is from Hirify.Global listVacancy from Hirify Global, list of international tech companies
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Job description

Text:
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TL;DR
Chiplet Design Architect (RISC-V/AI): Defining next-generation chiplet-based compute platforms and scalable System-in-Package solutions with an accent on PCIe, die-to-die connectivity, system management, and confidential computing. Focus on architecting high-performance CPU subsystems, integrating third-party IP, and balancing performance, security, and reliability across hardware, firmware, and system software.

Location: Remote, based in the United States

Compensation: $100,000–$500,000 annually, including base and variable compensation targets.

Company

Tenstorrent develops AI computing platforms integrating RISC-V CPUs, software, compilers, networking, and semiconductor technologies.

What you will do

  • Define architectures for next-generation chiplet-based compute platforms and scalable System-in-Package solutions.
  • Own platform subsystems including PCIe, die-to-die connectivity, system management, and confidential computing.
  • Lead cross-functional architecture efforts across architecture, hardware, software, and external IP partners.
  • Make architectural decisions in complex environments with evolving requirements.
  • Drive robust, production-ready chiplet architectures for high-performance RISC-V CPUs.

Requirements

  • Bachelor’s, Master’s, or Ph.D. in Computer Engineering, Electrical Engineering, Computer Science, or a related field.
  • 10+ years of experience in SoC, CPU, or chiplet architecture for high-performance computing or server-class systems.
  • Expertise in PCI Express Root Complex, RCiEP, coherent fabrics including CHI-C2C, IOMMU, ATS/PRI, MSI, CXL.mem, and TEE-I/O.
  • Deep understanding of boot, reset, debug, and power management for high-performance CPUs.
  • Ability to lead cross-functional architecture efforts, influence technical direction, and communicate across engineering organizations.
  • Employment is contingent on eligibility to access U.S. export-controlled technology under applicable U.S. export laws.

Culture & Benefits

  • Collaborative environment focused on curiosity and solving complex technical problems.
  • Opportunities to work across hardware, firmware, operating systems, virtualization, and system architecture.
  • Exposure to confidential computing, coherent fabrics, PCIe, and die-to-die communication.
  • Competitive compensation package and benefits.
  • Equal opportunity employment.

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