Chief Engineer, Process (Semiconductor)

Location: Onsite in Cabuyao, Philippines

Company

hirify.global is a global semiconductor manufacturer focused on delivering innovative and reliable components for various electronics industries.

What you will do

• Lead process improvement initiatives to enhance cost, quality, yield, and productivity within the Mold process.
• Develop and optimize Mold processes using statistical tools such as SPC, DOE, and FMEA.
• Drive investigations and corrective actions for customer complaints and production quality issues.
• Own Mold yield performance by monitoring defects and ensuring process stability.
• Develop and maintain technical documentation, including Control Plans and Work Instructions.
• Collaborate with cross-functional teams on equipment specifications and process standardization across sites.

Requirements

• Bachelor's Degree in Engineering.
• At least 8 years of experience in Semiconductor Assembly Engineering, preferably in Mold Process Engineering.
• Strong technical knowledge of Mold equipment, tooling, and Epoxy Molding Compound (EMC) materials.
• Proficiency in Minitab, JMP, SPC, DOE, FMEA, and DFM.
• Proven track record of driving process optimization and cost reduction in a manufacturing environment.
• Strong analytical, troubleshooting, and project management skills.

Culture & Benefits

• Competitive salary and comprehensive benefits package.
• Opportunities for professional development and career growth.
• Strong commitment to workplace safety and employee well-being.
• Innovative, dynamic, and inclusive work environment.
• Support for diversity through employee resource groups, including Pride and Women's groups.