Chief Engineer, Process (Semiconductor)

TL;DR

Chief Engineer, Process (Semiconductor): Driving process excellence in the Mold process to improve cost, quality, and yield within semiconductor assembly with an accent on process capability enhancement and statistical analysis. Focus on optimizing manufacturing robustness, implementing SPC and DOE, and resolving complex quality concerns.

Location: Onsite in Cabuyao, Philippines

Company

hirify.global is a global semiconductor manufacturer focused on delivering innovative and reliable components for various electronics industries.

What you will do

• Lead process improvement initiatives to enhance cost, quality, yield, and productivity within the Mold process.
• Develop and optimize Mold processes using statistical tools such as SPC, DOE, and FMEA.
• Drive investigations and corrective actions for customer complaints and production quality issues.
• Own Mold yield performance by monitoring defects and ensuring process stability.
• Develop and maintain technical documentation, including Control Plans and Work Instructions.
• Collaborate with cross-functional teams on equipment specifications and process standardization across sites.

Requirements

• Bachelor's Degree in Engineering.
• At least 8 years of experience in Semiconductor Assembly Engineering, preferably in Mold Process Engineering.
• Strong technical knowledge of Mold equipment, tooling, and Epoxy Molding Compound (EMC) materials.
• Proficiency in Minitab, JMP, SPC, DOE, FMEA, and DFM.
• Proven track record of driving process optimization and cost reduction in a manufacturing environment.
• Strong analytical, troubleshooting, and project management skills.

Culture & Benefits

• Competitive salary and comprehensive benefits package.
• Opportunities for professional development and career growth.
• Strong commitment to workplace safety and employee well-being.
• Innovative, dynamic, and inclusive work environment.
• Support for diversity through employee resource groups, including Pride and Women's groups.