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Chief Engineer, Process (Mold)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Philippines
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Chief Engineer, Process (Mold) (Semiconductor Manufacturing): Leading Mold process, tooling, and equipment optimization in semiconductor assembly manufacturing with an accent on yield improvement, quality, cost reduction, and process robustness. Focus on developing transfer molding processes, qualifying tooling and equipment, resolving complex defect mechanisms, and standardizing manufacturing practices across global teams.

Location: Cabuyao, Philippines

Company

hirify.global operates in semiconductor assembly manufacturing, focusing on manufacturing performance, process quality, and operational excellence.

What you will do

  • Lead Mold process, tooling, and equipment improvement initiatives to increase yield, quality, productivity, process capability, and cost performance.
  • Act as the technical expert for Mold tooling design, qualification, optimization, maintenance strategies, and troubleshooting.
  • Develop and optimize robust transfer molding processes using SPC, DOE, FMEA, MSA, and structured problem-solving methods.
  • Lead process characterization, equipment evaluations, tooling qualifications, and technology transfers for new products and process enhancements.
  • Investigate customer complaints, production excursions, OQA findings, and Mold-related quality issues, driving corrective actions.
  • Mentor Mold Process Engineers and collaborate with global engineering, operations, quality, maintenance, and supply chain teams.

Requirements

  • Bachelor's degree in Engineering and 8+ years of semiconductor assembly manufacturing experience, including extensive Mold Process Engineering experience in auto-molding and manual molding.
  • Strong expertise in transfer molding, Mold equipment platforms, mold tooling design, tooling qualification and maintenance, and Epoxy Molding Compound materials.
  • Hands-on experience with Mold equipment suppliers and platforms, including setup, optimization, troubleshooting, and process characterization.
  • Experience with tooling development, cavity balancing, mold chase optimization, runner and gate design evaluation, and defect reduction.
  • Proficiency in Minitab, JMP, SPC, DOE, FMEA, MSA, DFM, Six Sigma, 8D, DMAIC, Phenomena Mechanism, and root cause analysis methodologies.
  • Strong analytical, troubleshooting, project management, leadership, stakeholder management, communication, and presentation skills.

Culture & Benefits

  • Competitive salary and benefits package.
  • Professional development and career growth opportunities.
  • Commitment to workplace safety and employee well-being.
  • Innovative and dynamic work environment.
  • Inclusive and accessible recruitment process with reasonable adjustments available.
  • Employee resource groups, including Pride Network and local and global women's groups.

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