Mechanical Design Manager (Semiconductor Equipment)

Location: Milpitas, California, United States; onsite role

Salary: $181,000–$307,700 annually

Company

hirify.global develops metrology, inspection, and process-control systems for the semiconductor manufacturing ecosystem, including wafer and reticle inspection equipment.

What you will do

• Lead a team of mechanical or opto-mechanical engineers developing advanced wafer inspection equipment.
• Drive mechanical design efforts from product concept through production and commercial launch.
• Translate system-level requirements into practical, innovative engineering solutions.
• Set technical strategies and lead execution in a complex, multidisciplinary environment.
• Align cross-functional stakeholders, communicate technical concepts, and drive engineering decisions.
• Build and develop engineering talent while resolving complex design problems.

Requirements

• Bachelor’s degree with 15+ years, master’s degree with 10+ years, or PhD with 7+ years of relevant experience, including demonstrated leadership experience.
• Proven success leading mechanical design efforts for commercially successful technology products.
• Experience leading engineering teams and driving technical execution in multidisciplinary development environments.
• Strong experience with precision systems or semiconductor equipment design.
• Expertise in either opto-mechanical systems, including optical mounting, alignment, tolerancing, and DUV applications, or platform design involving stages and chucks, vibration isolation, motion control, thermal management, purging, and structural design.
• Strong communication, influencing, problem-solving, and cross-functional decision-making skills.

Culture & Benefits

• Work in a multidisciplinary engineering environment focused on semiconductor manufacturing innovation.
• Medical, dental, vision, life, and other voluntary benefits.
• 401(k) with company matching and employee stock purchase program.
• Paid time off, company holidays, and family care and bonding leave.
• Tuition reimbursement, student debt assistance, career development programs, financial planning, and wellness benefits.

Hiring process

• Recruiting includes multiple interviews with hiring managers, conducted in person or by video conference.