Package and PCB Layout Engineer (RF)

TL;DR

Package and PCB Layout Engineer (RF): Designing and optimizing RF hardware, including PCB and package layouts for WLAN and Bluetooth technologies with an accent on co-design optimization and physical design. Focus on implementing design rules for substrate/PCB technologies and ensuring compliance with DRC and DFM requirements.

Location: On-site in Haifa, Israel

Company

hirify.global is a global leader in semiconductor innovation, creating processors and connectivity solutions that power next-generation technologies.

What you will do

• Design and optimize RF HW, including PCB and Package Layout for WLAN and Bluetooth applications.
• Define floorplans and physical designs for RF circuit architecture.
• Collaborate with cross-disciplinary teams for Si-Package-Board co-design optimization.
• Own the PCB layout process from component placement to final output.
• Implement design rules for specific substrate/PCB technologies, ensuring compliance with DRC and DFM.

Requirements

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related field.
• 6+ years of experience in PCB and package layout.
• Proficiency in Cadence Allegro.
• Strong knowledge of RF fundamentals, electromagnetic theory, and RF system analysis.
• Experience with circuit simulation tools and debugging techniques.

Nice to have

• Experience with RF physical design for wireless products, including Si-Package-Board co-design.
• Knowledge of Mentor CAD, AutoCAD, and/or SolidWorks.
• Ability to solve complex problems within cross-functional teams.