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обновлено 7 дней назад

Package and PCB Layout Engineer (RF)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Israel
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

Текст:
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TL;DR
Package and PCB Layout Engineer (RF): Designing and optimizing RF hardware, including PCB and package layouts for WLAN and Bluetooth technologies with an accent on co-design optimization and physical design. Focus on implementing design rules for substrate/PCB technologies and ensuring compliance with DRC and DFM requirements.

Location: On-site in Haifa, Israel

Company

hirify.global is a global leader in semiconductor innovation, creating processors and connectivity solutions that power next-generation technologies.

What you will do

  • Design and optimize RF HW, including PCB and Package Layout for WLAN and Bluetooth applications.
  • Define floorplans and physical designs for RF circuit architecture.
  • Collaborate with cross-disciplinary teams for Si-Package-Board co-design optimization.
  • Own the PCB layout process from component placement to final output.
  • Implement design rules for specific substrate/PCB technologies, ensuring compliance with DRC and DFM.

Requirements

  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related field.
  • 6+ years of experience in PCB and package layout.
  • Proficiency in Cadence Allegro.
  • Strong knowledge of RF fundamentals, electromagnetic theory, and RF system analysis.
  • Experience with circuit simulation tools and debugging techniques.

Nice to have

  • Experience with RF physical design for wireless products, including Si-Package-Board co-design.
  • Knowledge of Mentor CAD, AutoCAD, and/or SolidWorks.
  • Ability to solve complex problems within cross-functional teams.

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