Principal ASIC Package Design Engineer (Aerospace)

TL;DR

Principal ASIC Package Design Engineer (Aerospace): Leading advanced ASIC package architecture and execution for high-performance mixed-signal and digital SoCs with an accent on FC-BGA and MCM solutions. Focus on defining end-to-end package strategy, ensuring first-pass success for power-dense space-grade electronics, and driving technical standards from architecture through production.

Location: Must be based in Seattle, WA (Onsite). Role requires U.S. Person status due to ITAR export control regulations.

Salary: $200,000 – $280,000 + equity

Company

hirify.global is a Series C space startup mass-producing high-power satellite platforms for missions ranging from LEO to deep space.

What you will do

• Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up and power delivery.
• Lead package-level trade studies covering performance, thermal, SI/PI, and manufacturability.
• Define long-term packaging roadmaps and organizational design standards.
• Partner with silicon and systems teams to co-optimize die floorplans and package interfaces.
• Serve as the primary technical interface to substrate vendors, assembly houses, and OSATs.
• Drive material selection and assembly process optimization for high-reliability space hardware.

Requirements

• Bachelor’s degree in Packaging, Mechanical, or Electrical Engineering.
• 10+ years of experience in ASIC package design with deep expertise in FC-BGA.
• Must be a U.S. Person (citizen, permanent resident, or protected individual) for ITAR compliance.
• Proven track record of delivering high-pin-count, high-performance ASIC packages into production.
• Proficiency in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
• Experience working directly with OSATs and substrate vendors.

Nice to have

• Experience with MCM or heterogeneous integration (chiplets, interposers).
• Background in high-speed digital or mixed-signal SoCs.
• Familiarity with aerospace, space, or high-reliability electronics.
• History of scaling package design methodology within an organization.

Culture & Benefits

• Comprehensive benefits including medical, dental, and vision coverage.
• Paid time off and paid parental leave.
• Equity participation in a high-growth space startup.
• Opportunity to contribute to groundbreaking satellite technology for deep space missions.