Process Sustaining Engineer (Die Attach/DACA Engineering)

TL;DR

Process Sustaining Engineer (Die Attach/DACA Engineering): Supporting stable Die Attach manufacturing by maintaining process capability and reducing defects with an accent on yield improvement and process variation reduction. Focus on conducting DOE, analyzing SPC trends, and investigating yield excursions to ensure manufacturing stability.

Location: Seremban, Malaysia

Company

hirify.global is a global semiconductor company focused on delivering essential components for a smarter, greener, and safer world.

What you will do

• Monitor process performance and analyze SPC trends to reduce variation.
• Investigate yield excursions and perform detailed defect analysis.
• Conduct Design of Experiments (DOE) to improve process capability.
• Update work instructions and support engineering evaluations.
• Support customer qualifications to ensure high product quality.

Requirements

• Bachelor's Degree in Engineering.
• 1–5 years of experience in the semiconductor industry.
• Strong knowledge of the Die Attach process.
• Proficiency with JMP, SPC, and Minitab.

Culture & Benefits

• Equal-opportunity employer with a strong commitment to diversity and inclusion.
• Access to employee resource groups, including Pride Network and Women's groups.
• Goal-driven commitment to increasing women in management positions to 30% by 2030.
• Inclusive and accessible recruitment process for all applicants.