Advanced Packaging SI/PI Staff Engineer (Semiconductor)

TL;DR

Advanced Packaging SI/PI Staff Engineer (Semiconductor): Designing and optimizing signal and power integrity for complex 2D/2.5D/3D semiconductor packages with an accent on high-speed signaling and power delivery networks. Focus on performing wiring studies, executing simulation tasks for sign-off, and collaborating with physical design teams to meet challenging electrical requirements.

Location: Must be based in Westborough, MA or Burlington, VT

Company

hirify.global is a leading semiconductor company providing essential infrastructure solutions for enterprise, cloud, and AI architectures.

What you will do

• Perform SI/PI analysis and optimization for 2D, 2.5D, and 3D package designs.
• Interface with product design teams to optimize floor-planning and power delivery networks.
• Conduct wiring studies to determine optimal signal routing and package size.
• Execute simulation tasks for signal and power integrity sign-off.
• Collaborate with physical designers and IP teams to optimize electrical performance.
• Evaluate package or PCB designs against challenging electrical requirements.

Requirements

• Bachelor’s degree in Electrical Engineering or related field with 2+ years of professional experience in package or PCB design.
• Master’s degree or PhD in Electrical Engineering with relevant coursework in signal integrity and power delivery.
• Strong understanding of signal and power integrity fundamentals.
• Proficiency with simulation tools such as Ansys HFSS, Keysight ADS, or Cadence Sigrity.
• Must be eligible to access export-controlled information under U.S. export control laws.
• Strong communication and documentation skills.

Culture & Benefits

• Comprehensive financial well-being programs including an employee stock purchase plan.
• Robust mental health resources and family support programs.
• Recognition and service awards for employee contributions.
• Commitment to diversity and equal opportunity employment.