Package Development, Signal Integrity and Power Integrity Principal Engineer

TL;DR

Package Development, Signal Integrity and Power Integrity Principal Engineer (High-speed IC packaging): Develop advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond with an accent on signal integrity, power integrity, and electrical modeling/characterization. Focus on solving complex SI/PI challenges across manufacturing and assembly tolerances while coordinating cross-functional teams and package suppliers to deliver manufacturable, reliable, and cost-compliant package designs.

Location: Ottawa, Canada

Salary: CAD 145,800 - 194,400 per annum

Company

hirify.global develops semiconductor solutions for data infrastructure across enterprise, cloud, AI, and carrier architectures.

What you will do

• Own package development for high-speed semiconductor packages, including electrical design, modeling, and characterization across signal and power integrity.
• Account for manufacturing and assembly tolerances to ensure performance, reliability, and cost requirements are met.
• Interface with package suppliers to select package technology, drive layout, and ensure manufacturability and compliance.
• Collaborate with marketing and IC designers to define achievable package specifications and contribute to new package technology development.
• Support SI/PI and packaging activities with automation and scripting to improve development workflows.
• Investigate and debug EMI/EMC issues using simulation and measurement results.

Requirements

• Bachelor’s degree in Computer Science, Electrical Engineering, or related fields with 5–8 years of experience, or Master’s/PhD with 1–3 years of experience.
• Strong fundamentals in EM, transmission lines, and microwave theory.
• Hands-on experience with 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, and Cadence Clarity.
• Experience with VNA and TDR measurements for package and PCB characterization, plus frequency-domain and time-domain knowledge of high-speed signaling.
• Working knowledge of circuit design tools such as Spectre, ADS, and HSpice.
• Experience with high-speed electronic packaging for digital and analog ICs, including power plane design, modeling, and analysis (e.g., PowerSI, SIwave).

Nice to have

• Experience with 2.5D/3D package development.
• Familiarity with packaging technologies, materials, package substrate design rules, and assembly rules.
• Knowledge of thermal and mechanical analysis for IC package development.
• Experience automating SI/PI/packaging using scripting tools such as Python.
• Track record of new product introduction from concept through development and production.

Culture & Benefits

• Competitive compensation and benefits.
• Collaborative work environment with shared transparency and inclusivity.
• Support for tools and resources to succeed and grow in doing work that matters.

Hiring process

• Interviews evaluate individual experience, thought process, and communication in real time.
• AI tools are not permitted during interviews and may lead to disqualification.