R&D Engineer

TL;DR

R&D Engineer (Semiconductor Advanced Packaging): Owns advanced packaging and system-in-package assembly technology roadmaps, translating system-level performance requirements into modules while collaborating with internal IC teams and external foundry/OSAT partners. Focus on solving leading-edge AI/HPC module packaging challenges with hands-on evaluation, qualification planning, reliability failure mechanism analysis, and risk mitigation from concept through transfer to high-volume manufacturing.

Company

hirify.global develops semiconductor and infrastructure technologies.

What you will do

• Lead multi-chip semiconductor assembly and system pathfinding for leading-edge AI and high-performance computing modules.
• Drive development of new assembly technology from early R&D through product introduction, owning key parts of the advanced packaging and assembly roadmap.
• Define technology requirements, evaluation and qualification plans, and provide hands-on support during transitions from process R&D to product development.
• Lead advanced packaging technology problem solving, including design and product enablement.
• Manage projects independently from concept through transfer to high-volume manufacturing, coordinating internal and external collaborators.
• Perform risk assessment and coordinate cross-functional risk mitigation across multiple parallel technology projects.

Requirements

• Location: San Jose, CA (USA)
• MSEE in Electrical Engineering or related field required.
• 15+ years of experience in semiconductor process technology and advanced packaging/manufacturing in R&D and integration roles, or PhD with 12+ years in the same domain.
• Broad knowledge of advanced packaging/assembly and silicon process technologies, including thermal solutions, power delivery, and electrical/optical communication.
• Experience with serial and parallel interface design for chip-to-chip and external module communication.
• Experience with parametric/yield data analysis and root-cause finding tools for yield failure mechanisms (EFA, PFA), plus thermal and stress simulation tools.

Culture & Benefits

• Annual base salary range: $167,500–$268,000.
• Discretionary annual bonus and potential new-hire equity grant and annual equity awards.
• Medical, dental, and vision plans; 401(k) participation with company matching; ESPP; EAP.
• Paid holidays, paid sick leave, and vacation time; paid family leave and other leaves per applicable laws.
• Equal opportunity employer.

Hiring process

• Create a candidate login account (if first time) and sign in before applying.
• Application review followed by interview steps as determined during the hiring process.