Packaging Module Development Engineer (Semiconductors)

TL;DR

Packaging Module Development Engineer (Semiconductors): Developing and optimizing advanced assembly processes and equipment for next-generation substrate packaging technologies with an accent on manufacturing efficiency and product reliability. Focus on executing Design of Experiments (DOE), applying statistical analysis to improve yield, and qualifying new tools and materials.

Location: On-site presence required in Phoenix, Arizona, USA

Salary: $115,110 - $162,500 USD

Company

hirify.global is a global leader in semiconductor manufacturing and foundry services, developing cutting-edge silicon process and packaging technology for the AI era.

What you will do

• Develop and support advanced assembly processes for next-generation substrate packaging technologies.
• Plan and execute Design of Experiments (DOEs) to optimize process, material, and equipment interactions.
• Apply statistical analysis (SPC) and data-driven methodologies to improve quality, reliability, and manufacturing efficiency.
• Collaborate with Procurement and Supplier Quality teams to establish material specifications.
• Troubleshoot packaging and manufacturing issues using engineering principles and analytical problem-solving.
• Contribute to the design and qualification of advanced substrate technologies, including EMIB and Co-EMIB.

Requirements

• Bachelor's degree in Materials Science, Mechanical, Electrical, or Chemical Engineering with 1+ year of experience, OR a Master's/PhD in a related discipline.
• Knowledge of manufacturing process control and equipment adjustment.
• Must be based in or able to work on-site in Phoenix, Arizona.

Nice to have

• Experience with DOE principles and statistical analysis tools such as JMP or Python.
• Background in organic/inorganic materials and characterization techniques (DSC, TGA, FTIR, XPS, SEM).
• Familiarity with machine learning techniques and relational databases for data modeling.

Culture & Benefits

• Competitive total compensation package including pay and stock bonuses.
• Comprehensive benefit programs covering health, retirement, and vacation.
• Opportunity to develop as a Tool and Process Owner within a state-of-the-art manufacturing environment.
• Fast-paced, innovative work culture focused on pushing the boundaries of semiconductor technology.