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Senior Mechanical Engineer (packaging and integration) (Semiconductor Equipment)

117 800 - 200 300$
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Senior Mechanical Engineer (packaging and integration) (Semiconductor Equipment): Designing and integrating mechanical packaging, facility infrastructure, and subsystem systems for advanced semiconductor inspection platforms with an accent on ultra-high vacuum environments, cable and fluid routing, and precision equipment enclosures. Focus on thermal, structural, and vibration analysis, fab integration, engineering documentation, and cross-functional delivery of manufacturable and serviceable EUV inspection systems.

Location: Milpitas, California, United States

Salary: $117,800–$200,300 annually

Company

hirify.global develops metrology, inspection, and process-control systems for the semiconductor manufacturing ecosystem, including reticle inspection solutions for mask shops and semiconductor fabs.

What you will do

  • Lead mechanical packaging and system integration for advanced semiconductor inspection platforms, including EUV actinic defect inspection systems.
  • Integrate electrical cabinets, power distribution, electrical interconnects, cable routing, and gas, water, and vacuum systems.
  • Develop routing strategies and support fab and sub-fab layouts, facility hook-ups, and installation planning.
  • Design acoustic, vibration, and thermal enclosures for precision equipment.
  • Perform thermal, structural, and vibration analysis and create P&IDs, system layouts, assembly drawings, and interface control documentation.
  • Coordinate with electrical, systems, manufacturing, field, supplier, and internal stakeholder teams; support design reviews, risk assessments, and RCCA/8D problem-solving.

Requirements

  • Bachelor’s degree in Mechanical Engineering or a related field, with 5+ years of related experience; equivalent requirements include a master’s degree with 3 years of experience or a doctorate with no required experience.
  • Experience in semiconductor capital equipment or similarly complex systems.
  • Experience designing and integrating systems in UHV or cleanroom environments.
  • Proficiency in PTC Creo for 3D CAD, assemblies, and detailing, plus experience with PDM/PLM systems such as Windchill.
  • Strong knowledge of P&IDs, fluid systems, electrical cabinet packaging, power distribution, gas, water, vacuum systems, and constrained cable and tubing routing.
  • Experience with thermal and structural analysis methodologies and strong cross-functional communication skills.

Nice to have

  • Familiarity with semiconductor fab infrastructure and facility integration.
  • Knowledge of vibration isolation and acoustic design techniques.
  • Experience with SEMI S2, S8, and S10 standards.

Culture & Benefits

  • Work in a matrixed, cross-functional engineering environment focused on next-generation semiconductor inspection systems.
  • Medical, dental, vision, life, and other voluntary benefits.
  • 401(k) with company matching and an employee stock purchase program.
  • Paid time off, company holidays, and family care and bonding leave.
  • Tuition reimbursement, student debt assistance, development programs, career growth opportunities, financial planning benefits, and wellness support.

Hiring process

  • The recruiting process includes multiple interviews conducted in person or by video conference with hiring managers.

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