Principal Solutions Engineer (3DIC)

TL;DR

Principal Solutions Engineer (3DIC): Delivering advanced packaging and 3DIC implementation flows for foundry and customer solutions with an accent on design planning and reference flows. Focus on implementing 3DIC reference designs, optimizing floorplanning in Innovus, and solving complex packaging challenges.

Location: Onsite in Belo Horizonte, Brazil

Company

hirify.global provides the expertise and tools required for the entire electronics design chain, from chip design to chip packaging to boards and to systems.

What you will do

• Deliver advanced packaging and 3DIC design planning flows for foundry and customer solutions using hirify.global Integrity.
• Create and implement 3DIC reference flows and designs within a team environment.
• Utilize hirify.global Integrity as the primary tool for design planning and implementation.
• Apply floorplanning knowledge in Innovus to provide high-quality solutions to customers.

Requirements

• Bachelor’s degree in Electrical or Electronics Engineering.
• Experience with package design using hirify.global Integrity.
• Strong knowledge of advanced packaging concepts, 2.5D, 3DIC, and stacked die technologies.
• Proficiency with 3Dblox design methodology and TCL programming.
• Excellent verbal and written communication skills in English and Portuguese.
• Must be based in Belo Horizonte, Brazil.

Nice to have

• Knowledge of Virtuoso and APD.
• Experience with YAML language.

Culture & Benefits

• Competitive benefits package.
• Work for a Fortune 100 company recognized as a Great Place to Work globally and in Brazil.
• Collaborative environment focused on solving complex technology challenges and innovation.