Principal Solutions Engineer (Allegro Package Designer)

TL;DR

Principal Solutions Engineer (Allegro Package Designer): Delivering advanced packaging and 3DIC implementation flows for foundry and customer solutions with an accent on 3D structures and routing. Focus on creating 3DIC reference flows, scripting with Allegro SKILL, and implementing complex RDL designs.

Location: Belo Horizonte, Brazil

Company

hirify.global is a global leader providing the expertise and tools required for the entire electronics design chain, from chip design to systems.

What you will do

• Create and implement 3DIC reference flows and designs.
• Route laminates and RDL designs using Allegro Package Designer (APD).
• Code technology files and create rules and constraints.
• Implement bond wires, bumps, and 3D structures.
• Automate workflows using Allegro SKILL scripting.
• Handle packaging formats including GDS, Gerber, IPC, and DXF for import and export.

Requirements

• Complete Bachelor’s degree in Electrical or Electronics Engineering.
• Proven experience with package design and Allegro Package Designer (APD).
• Strong knowledge of advanced packaging concepts, 2.5D, 3DIC, and stacked die technologies.
• Ability to create Virtuoso-ready APD package files.
• Excellent verbal and written communication skills.

Nice to have

• Programming knowledge with Allegro Skill and Ravel.

Culture & Benefits

• Competitive benefits package.
• Employment category: CLT.
• Standard 40-hour work week.
• Work for a company globally recognized as a Great Place to Work and a Fortune 100 Best Company.