Package Power Integrity Intern (Electrical Engineering)

TL;DR

Package Power Integrity Intern (Electrical Engineering): Developing and optimizing power integrity (PI) for IC packages with an accent on extraction, analysis, and optimization of high-performance interfaces. Focus on verifying power performance through simulation and ensuring designs meet electrical technical specifications.

Location: On-site in Phoenix, Arizona, US

Salary: $82,000–$110,900

Company

A global leader in semiconductor manufacturing, providing cutting-edge silicon process and packaging technology for the AI era.

What you will do

• Extract, analyze, and optimize high-performance interfaces for electronic components.
• Review electrical technical specifications to ensure package designs meet requirements.
• Implement creative design approaches and solutions in collaboration with layout teams.
• Verify power performance using simulation tools.

Requirements

• Pursuing a Masters or PhD in Electrical Engineering
• At least 1 year of experience with circuit and electromagnetic simulation tools
• Understanding of Power Integrity or electromagnetics.
• Strong analytical and problem-solving skills for debugging complex issues.

Nice to have

• Experience with SPICE, Ansys tools (HFSS, Q2D, Q3D), or Cadence tools (Allegro, Power SI).
• Hands-on experience in power integrity or product design.
• Understanding of IC Packaging.

Culture & Benefits

• Competitive pay and stock bonuses.
• Comprehensive health, retirement, and vacation programs.
• Opportunity to work within a worldwide factory network in the semiconductor industry.