Advanced Packaging SI/PI Senior Staff Engineer

TL;DR

Advanced Packaging SI/PI Senior Staff Engineer: Designing and optimizing high-speed signal and power delivery networks for complex multi-chip semiconductor packages with an accent on 3D packaging and co-packaged optics. Focus on performing SI/PI analysis, floor-planning, and wiring studies to ensure electrical performance in high-speed interfaces like HBM, DDR, and SERDES.

Location: Must be based in Chandler, AZ

Salary: $142,700–$211,230 per annum

Company

hirify.global is a leading semiconductor company providing essential data infrastructure solutions across enterprise, cloud, AI, and carrier architectures.

What you will do

• Perform SI/PI analysis and optimization for 2D, 2.5D, and 3D package designs.
• Collaborate with physical design and IP teams to optimize floor-planning and power delivery networks.
• Execute wiring studies to determine optimal signal routing and package size.
• Conduct simulation tasks for signal and power integrity sign-off.
• Document analysis results and present findings in cross-functional design reviews.
• Provide technical leadership and guidance within the advanced packaging team.

Requirements

• Bachelor’s degree in Electrical Engineering with 5+ years of experience, or Master’s/PhD with 3+ years of experience.
• Must be eligible to access export-controlled information under U.S. law.
• Strong understanding of signal and power integrity fundamentals.
• Proficiency with simulation tools such as Ansys HFSS, Keysight ADS, or Cadence Sigrity.
• Experience with high-speed interfaces including HBM, DDR, SERDES, and Die2Die.
• Knowledge of circuit extraction, simulation techniques, and semiconductor packaging technologies.

Culture & Benefits

• Comprehensive financial well-being programs including an employee stock purchase plan.
• Robust family support and mental health resources.
• Recognition and service awards for contributions and milestones.
• Commitment to an inclusive work environment with equal opportunity employment.