Packaging Module Equipment Development Engineer (Semiconductor)

TL;DR

Packaging Module Equipment Development Engineer (Semiconductor): Developing assembly processes and equipment for future packaging platforms with an accent on manufacturing optimization, quality, and reliability. Focus on designing equipment specifications, utilizing DOE/SPC for process optimization, and integrating AI/ML for advanced metrology inspection.

Location: Onsite in Phoenix, Arizona, US

Salary: $133,800 – $188,890 USD

Company

hirify.global Foundry focuses on state-of-the-art semiconductor manufacturing and advanced packaging technology leadership for the AI era.

What you will do

• Develop and optimize assembly processes and equipment for future packaging platform technologies.
• Drive process optimization using Design of Experiments (DOE), Statistical Process Control (SPC), and data analysis.
• Maintain and develop equipment for evaluating silicon and package technologies under simulated field-use conditions.
• Collaborate with cross-functional teams to establish material specifications and ensure vendor performance and quality.
• Implement AI and ML applications for 2D/3D image processing in metrology and inspection systems.
• Lead technical problem-solving initiatives to improve manufacturing quality and equipment efficiency.

Requirements

• Bachelor's degree in Engineering, Physics, Chemistry, Materials Science, or related technical field with 5+ years of industry experience.
• Alternatively, a Master's degree with 3+ years or a PhD with 6+ months of engineering industry experience.
• Experience with inspection equipment and industrial engineering processes.
• Must be based in or be able to work onsite in Phoenix, Arizona.

Nice to have

• Experience with automated inspection tools, image processing algorithms, and artificial hirify.globalligence.
• Knowledge of semiconductor fabrication processes and advanced packaging/assembly.
• Project management experience delivering complex, time-critical technical projects.
• Strong technical problem-solving and innovation skills in manufacturing environments.

Culture & Benefits

• Competitive compensation package including base pay and stock bonuses.
• Comprehensive benefit programs covering health, retirement, and vacation.
• Opportunity to work at the forefront of semiconductor technology for the AI era.
• Professional growth within a worldwide factory network.