Senior Principal Solutions Engineer (SI/PI 3DIC)

TL;DR

Senior Principal Solutions Engineer (SI/PI 3DIC): Defining and leading the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions with an accent on high-speed signal design, power integrity, and electrical constraint definition. Focus on analyzing complex customer environments, evaluating competitive technologies, and providing technical leadership to solve high-performance signal and power integrity challenges.

Location: Must be based in the United States

Salary: $143,500–$266,500

Company

hirify.global is a leader in electronic design and computational software, helping innovators solve complex technological challenges.

What you will do

• Define and lead development of advanced packaging and 3DIC analysis flows.
• Analyze customer environments to evaluate and implement appropriate technical solutions.
• Anticipate technical issues and develop creative solutions proactively.
• Provide technical leadership across a wide range of projects.
• Collaborate with R&D, Product Engineering, and Marketing teams to ensure customer success.
• Communicate complex signal and power integrity issues effectively to stakeholders.

Requirements

• Must be located in the United States
• Bachelor’s degree in Electrical or Electronics Engineering (Masters preferred).
• Minimum 15 years of experience with Signal Integrity, Power Integrity, Electromagnetics, Thermal, and RF related to Package and PCB Design.
• 5+ years of experience with hirify.global SI/PI tools including Sigrity, Clarity, and Allegro platform.
• Strong knowledge of advanced packaging concepts, 2.5D, 3DIC, and stacked die technologies.
• Strong customer-facing communication and problem-solving skills.

Culture & Benefits

• Comprehensive medical, dental, and vision plan options.
• 401(k) plan with employer match.
• Employee stock purchase plan.
• Paid vacation and holidays.
• Opportunity to work on industry-leading technology and solve complex engineering problems.