Process Development Engineer (Wire Bond)

TL;DR

Process Development Engineer (Wire Bond): Developing and optimizing semiconductor assembly processes for new products and platforms with an accent on wire bond technology and FOL process stability. Focus on applying structured engineering methods like DOE, SPC, and FMEA to ensure high-yield manufacturing and robust product reliability.

Location: Seremban, Malaysia

Company

hirify.global is a global semiconductor manufacturer specializing in essential power and logic components for a wide range of electronic designs.

What you will do

• Develop and characterize new semiconductor process technologies from concept to high-yield manufacturing.
• Apply structured engineering methods including DOE, SPC, FMEA, and Six Sigma to optimize process performance.
• Lead technical discussions and troubleshooting for wire bond and FOL processes across project teams.
• Utilize statistical analysis tools like Minitab to drive data-based process improvements.
• Provide technical support for wire bond-related issues for internal and external customers.
• Conduct benchmarking and technology studies to support the package roadmap.

Requirements

• Bachelor’s degree in engineering or a related field.
• Minimum 5 years of experience in a semiconductor or manufacturing environment.
• Hands-on experience in FOL processes such as wafer dicing, die bond, plasma, and wire bond.
• Strong knowledge of wire bond packaging technologies.
• Proficiency in Six Sigma methodologies and statistical tools like Minitab or Statistica.
• Fluent English communication skills.

Culture & Benefits

• Commitment to diversity and inclusion with active employee resource groups like the Pride Network.
• Focus on professional growth and increasing women in management positions.
• Inclusive and accessible recruitment process with reasonable adjustments provided.
• Opportunity to work in a global, collaborative environment across multiple sites.