Advanced Packaging Technology Development Substrates Module Engineer (Semiconductor)

TL;DR

Advanced Packaging Technology Development Substrates Module Engineer (Semiconductor): Providing real-time factory support for substrate manufacturing operations with an accent on process troubleshooting, equipment recovery, and data collection. Focus on maintaining 24/7 production continuity, executing non-standard procedures, and ensuring compliance with safety and quality standards in a high-volume manufacturing environment.

Location: Must be based in Chandler, Arizona (Onsite, Nightshift)

Salary: $99,030–$139,810 USD

Company

hirify.global is a global leader in semiconductor manufacturing, driving innovation in silicon process and advanced packaging technology.

What you will do

• Provide real-time support for equipment, process, and product issues to ensure continuous 24/7 manufacturing.
• Execute non-standard procedures and perform inspections on substrate panels to collect development data.
• Write and update technical specifications, procedures, and Requests for Change (RFCs).
• Communicate key issues and updates with tool owners, process owners, and cross-functional partners.
• Support new tool enablement, lot disposition activities, and process troubleshooting efforts.
• Document and communicate all shift activities through detailed pass-downs to incoming teams.

Requirements

• Bachelor's degree in Materials, Mechanical, Chemical Engineering, Chemistry, or Physics with 1+ years of experience, or Master's degree with 0 years of experience.
• Must be able to work the night shift (Shift 4: PM-AM Sun-Tues and alternating Saturday nights).
• Must be authorized to work in the US (no immigration sponsorship provided).
• Must be able to work onsite in Chandler, Arizona.
• Proficiency in statistical data analysis, process characterization, and quality systems.

Nice to have

• Experience with design of experiments (DOE) and statistical process control (SPC).
• Knowledge of manufacturing process control and reliability testing.
• Experience in semiconductor manufacturing or packaging substrate development.
• Familiarity with metrology tool recipe creation and troubleshooting.

Culture & Benefits

• Competitive total compensation package including base pay and stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Opportunity to work on cutting-edge semiconductor and packaging technology.
• Collaborative environment within a worldwide factory network.