Process Integration Engineer (Semiconductor)

TL;DR

Process Integration Engineer (Semiconductor): Developing and defining integrated process flows for interconnect modules to drive semiconductor technology innovation. Focus on yield improvement, root cause analysis of defects, and supporting the transition from R&D to high-volume manufacturing.

Location: On-site in Hillsboro, OR or Phoenix, AZ

Salary: $103,730–$198,820 USD

Company

hirify.global is a global leader in semiconductor manufacturing and technology innovation, driving the roadmap for the AI era.

What you will do

• Develop and define integrated process flows for interconnect modules.
• Coordinate across lithography, etch, deposition, and metrology teams.
• Identify and mitigate yield loss mechanisms using statistical tools like SPC and DOE.
• Ensure reliability margins for electromigration and stress migration.
• Support the ramp-up of technology from R&D to high-volume manufacturing.
• Document process specifications and standard operating procedures.

Requirements

• PhD degree in Electrical Engineering, Physics, Material Science, or related discipline.
• 6+ months of experience in semiconductor device fabrication, nanotechnology, or electrical characterization.
• On-site presence required at designated hirify.global facilities.
• Strong data analysis and presentation skills.
• Ability to collaborate across cross-functional engineering teams.

Nice to have

• Proficiency in Python, SQL, or C/C++.
• Understanding of CMOS, FinFET, or GAA device physics.
• Experience with VLSI fabrication instruments like ALD or PE CVD.
• Knowledge of defect classification systems.

Culture & Benefits

• Competitive salary with stock bonuses and financial rewards.
• Comprehensive health, life, and disability insurance plans.
• Wellness programs and recreational amenities.
• Opportunities for career growth and professional development.
• Inclusive work environment committed to ethical hiring practices.