Die / Clip Attach Technical Expert (Semiconductor)

TL;DR

Die / Clip Attach Technical Expert (Semiconductor): Developing and implementing competitive technical solutions for semiconductor manufacturing processes with an accent on Die Bond, Wire Bond, and Mold technologies. Focus on driving equipment strategy, resolving complex technical challenges, and enhancing manufacturing performance in terms of cost, quality, and capability.

Location: Seremban, Malaysia (Onsite)

Company

hirify.global is a global semiconductor manufacturer specializing in essential power and logic devices.

What you will do

• Define and drive equipment strategies aligned with factory and package R&D roadmaps.
• Evaluate and select new equipment technologies for manufacturing processes.
• Lead equipment introduction and qualification projects.
• Solve complex and chronic technical issues in manufacturing.
• Drive improvement projects to enhance productivity, process capability, quality, and cost efficiency.
• Lead technical projects involving cross-functional and international teams.

Requirements

• Bachelor’s or master’s degree in engineering or a related discipline.
• Minimum 10 years of experience in semiconductor manufacturing and process engineering.
• Strong technical expertise in process and/or equipment engineering within semiconductor assembly operations.
• Proven experience in equipment selection, qualification, optimization, and technology introduction.
• Experience leading technical and cross-functional projects in a manufacturing environment.
• Strong analytical, troubleshooting, and stakeholder management skills.

Culture & Benefits

• Commitment to diversity and inclusion with active employee resource groups like the Pride Network and Women's groups.
• Equal-opportunity employer dedicated to inclusive recruitment and safe work environments.
• Focus on professional growth and industry-leading technology development.
• Support for global and local team collaboration.