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2 дня назад

Senior Signal Integrity / Power Integrity Engineer (Hardware)

180 000 - 275 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR

Senior Signal Integrity / Power Integrity Engineer (Hardware): Designing and simulating high-speed interconnects for next-generation Ethernet and optical networking platforms with an accent on 112G/224G PAM4 SerDes technologies. Focus on advanced 3D EM simulation, PCB material characterization, and optimizing power delivery for hyperscale, AI, and cloud networking systems.

Location: Must be based in Santa Clara, CA, USA

Salary: $180,000–$275,000 (Base pay)

Company

hirify.global is an industry leader in data-driven, client-to-cloud networking for large data centers, campus, and routing environments.

What you will do

  • Perform 3D EM design and simulation of high-speed interconnects using Ansys HFSS, SiWave, and Cadence Sigrity.
  • Develop and validate test vehicles to characterize next-generation PCB materials and packages.
  • Conduct S-parameter and time-domain measurements using VNA, TDR, and BERT equipment.
  • Perform link-level analysis for advanced standards like Ethernet 800G/1.6T and PCIe Gen6/Gen7.
  • Collaborate with hardware and mechanical teams to optimize stack-up, breakout, and routing strategies.
  • Support bring-up and debug of production boards to root-cause SI/PI issues.

Requirements

  • BS/MS/PhD in Electrical Engineering, Physics, or related field.
  • Solid understanding of signal integrity theory, S-parameter analysis, and channel modeling.
  • Hands-on experience with 2.5D/3D EM solvers such as Ansys HFSS, SiWave, Sigrity, or CST.
  • Strong lab skills using oscilloscopes, VNAs, TDRs, and BERTs.
  • Experience analyzing and simulating 56G/112G/224G PAM4 and NRZ serial links.
  • Familiarity with advanced PCB materials and manufacturing constraints.

Nice to have

  • Experience with co-packaged optics or chiplet-based architectures.
  • Knowledge of EMI/EMC considerations in photonic-electronic systems.
  • Understanding of thermal and mechanical effects on SI/PI performance.
  • Experience working with fabrication vendors and contract manufacturers.

Culture & Benefits

  • Competitive compensation including base salary, bonus, and equity.
  • Comprehensive benefits package including medical, dental, and vision insurance.
  • Focus on diversity, inclusion, and work-life balance.
  • Opportunities to work on cutting-edge AI and cloud networking technologies.

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