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2 дня назад

Packaging Process Engineer (Microdisplay)

121 000 - 214 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR

Packaging Process Engineer (Microdisplay): Driving process development, yield, and manufacturability for advanced microdisplay production lines with an accent on backend packaging and continuity testing. Focus on optimizing LCOS display output, overseeing tool qualification, and leading structured problem solving to ensure high-yield production.

Location: Chandler, USA. Must work in office 4+ days per week

Salary: $121,000 – $214,000 annually (depending on zone)

Company

A technology company creating the Snapchat app, Lens Studio, and Spectacles AR glasses.

What you will do

  • Own and optimize backend packaging processes for LCOS advanced displays from early development to high-volume manufacturing.
  • Serve as the primary technical interface for equipment, materials, and manufacturing partners, overseeing tool qualification and build readiness.
  • Develop and sustain assembly recipes, control plans, and SPC systems to improve CD/overlay, defectivity, and reliability.
  • Lead structured problem solving using DOEs, FMEA, and root cause analysis for yield excursions and parametric drifts.
  • Partner with cross-functional teams to define capacity models and WIP/uptime strategies.

Requirements

  • BS degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field.
  • 7+ years of experience as a process or packaging engineer in microfabrication fabs.
  • Direct experience designing and optimizing automated production equipment for semiconductors or displays.
  • Direct experience in final test for semiconductor or display packages.
  • Track record of improving yield and stability through structured experimentation (DOE) and SPC.
  • Ability to work in an ISO 5 cleanroom environment.

Nice to have

  • 10+ years of experience in process engineering and backend packaging.
  • Foundation in Six Sigma.
  • Experience with automated optical assembly and test equipment.
  • Expertise in developing wire bonding processes for high-density LOCS packages.
  • Strong expertise in die attach, marking, and final packing processes.

Culture & Benefits

  • "Default Together" culture emphasizing in-person collaboration with 4+ days per week in the office.
  • Comprehensive medical coverage and emotional/mental health support programs.
  • Paid parental leave.
  • Compensation packages including equity in the form of RSUs.
  • Inclusive and diverse work environment with equal opportunity employment.

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