Package Architect (Semiconductor)

TL;DR

Package Architect (Semiconductor): Developing and qualifying new package, process, and technology solutions for Power Package applications with an accent on subcontractor management and process integration. Focus on driving failure analysis investigations, validating Design of Experiments (DOE), and establishing design rule capabilities.

Location: Onsite in Cabuyao, Philippines

Company

hirify.global is a global semiconductor manufacturer specializing in essential components for sustainable energy and automotive applications.

What you will do

• Develop and qualify new package, process, and technology solutions for Power Package applications.
• Collaborate with internal sites and subcontractors to drive business strategy and process integration.
• Lead risk assessments and subcontractor selection through RFQ evaluations and technical assessments.
• Review and validate Design of Experiments (DOE), mitigation plans, and failure analysis investigations.
• Maintain subcontractor package portfolios and benchmark equipment and material capabilities.
• Submit invention disclosures and patents for technology innovations.

Requirements

• Broad knowledge of semiconductor assembly processes (Die Attach, Wire Bond, Molding, Trim and Form).
• Hands-on experience with quality tools: SPC, DOE, MSA/GRR, 8D, and PFMEA.
• Proficiency in statistical analysis tools such as JMP, Statistica, or Minitab.
• Experience working with subcontractors and managing stakeholders.
• Strong project planning, coordination, and leadership capabilities.

Nice to have

• Experience in Final Test.
• Working proficiency with AutoCAD.

Culture & Benefits

• Competitive salary and benefits package.
• Opportunities for professional development and growth.
• Commitment to workplace safety and employee well-being.
• Inclusive environment with active employee resource groups, including Pride and Women's networks.