Module Development Engineer (Semiconductors)

TL;DR

Module Development Engineer (Semiconductors): Leading the design and development of sophisticated manufacturing processes for semiconductor technology with an accent on process integration and equipment solutions. Focus on spearheading process and hardware development for emerging device architectures and optimizing high-volume manufacturing output.

Location: On-site in Hillsboro, Oregon, USA

Salary: $99,030–$188,890

Company

hirify.global is a global leader in semiconductor manufacturing, focusing on state-of-the-art silicon process and packaging technology for the AI era.

What you will do

• Lead the design and development of complex manufacturing processes, including material selection and parameter optimization.
• Drive the enablement of new technologies for high-volume manufacturing and future device architectures.
• Conduct theoretical simulations and practical engineering studies to meet device specifications.
• Develop technology roadmaps to maintain industry leadership in semiconductor innovation.
• Collaborate with suppliers to implement advanced equipment and material solutions.
• Execute modifications to existing equipment to improve production efficiency and output.

Requirements

• Bachelor's (3+ years), Master's (2+ years), or PhD in Materials Science, Mechanical, Electrical, or Chemical Engineering.
• Experience in semiconductor processing, process development, or cleanroom environments.
• Proficiency in statistical tools such as Statistical Process Control (SPC) and Design of Experiments (DOE).
• Experience in direct wafer-level assembly module engineering or fab process/hardware development.
• Must be able to work on-site in Hillsboro, Oregon.

Nice to have

• Familiarity with semiconductor packaging and assembly technologies.
• Experience with JMP software for data analysis.
• Prior experience with Singulation (Laser and Dicing processes).
• Proven track record in driving continuous improvement in multidisciplinary teams.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive benefit programs covering health, retirement, and vacation.
• Opportunity to work with world-class teams on cutting-edge semiconductor technology.
• Focus on innovation and pushing the boundaries of industry standards.